Re: [PATCH RESEND v4 0/2] 96boards: add thermal senor support to hikey board

[Eduardo Valentin <edubezval@gmail.com>]

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On Mon, May 04, 2015 at 10:52:18AM +0800, Xinwei Kong wrote:
> From: kongxinwei <kong.kongxinwei@hisilicon.com>
> 
> The Linaro connect introduce 96boards series in Hong Kong,The HiKey board
> is the first board to be certified 96Boards Consumer Edition compatible.
> This board is based on the HiSilicon SoC. you can get more information
> from https://www.96boards.org.
> 
> The hisilicon SoC contains thermal module, this thermal module has 4 sensors,
> 
> 	- sensor 0: local sensor;
> 	- sensor 1: remote sensor for ACPU cluster 1;
> 	- sensor 2: remote sensor for ACPU cluster 2;
> 	- sensor 3: remote sensor for GPU;
> 
> It can obtain this device temperature by operating this hardware. The new
> sensor driver satisfies thermal framework and to realize the ACPU ,GPU and
> so on to cool function.
> 
> Changes v0->v1;
> * Delete this hi6220 dtsi.
> * Fix documentation and error checks.
> * Modify this driver which makes use of kernel to decide how to dynamically
>   bind the interrupt to hottest sensor.
> * Delete "sensor-thres-temp" property and read thermal_zone trips points
>   replace of it.
> * Delete "sensor-reset-temp" property and define the fixed value replace
>   of it.
> 
> Changes v1->v2;
> * change patch's position between binding document and driver file
> * clean up some regiser for enabling thermal sensor
> * use mutex lock to replace the spin lock
> 
> Changes v2->v3;
> * delete sensor id property in binding document 
> * fix sensor driver to satisfy sensor register after deleting sensor id
>   property
> 
> Changes v3->v4;
> * using "usleep_range" function instead of "msleep" function
> * delete code detail error
> 
> kongxinwei (2):
>   dt-bindings: Document the hi6220 thermal sensor bindings
>   thermal: hisilicon: add new hisilicon thermal sensor driver
> 
>  .../bindings/thermal/hisilicon-thermal.txt         |  23 ++
>  drivers/thermal/Kconfig                            |   8 +
>  drivers/thermal/Makefile                           |   1 +
>  drivers/thermal/hisi_thermal.c                     | 437 +++++++++++++++++++++

Can you please include a patch adding the DT bindings for a board in you
next version? Even if the patches don't go in one single tree, it is
good to review all patches (DT and drivers) in one single patch series.

>  4 files changed, 469 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>  create mode 100644 drivers/thermal/hisi_thermal.c
> 
> -- 
> 1.9.1
> 
> 

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