From mboxrd@z Thu Jan 1 00:00:00 1970 From: Eduardo Valentin Subject: Re: [PATCH v5 3/3] dts: hi6220: enable thermal sensor for hisilicon SoC Date: Tue, 19 May 2015 21:51:01 -0700 Message-ID: <20150520045100.GB4295@localhost.localdomain> References: <1431933109-22764-1-git-send-email-kong.kongxinwei@hisilicon.com> <1431933109-22764-4-git-send-email-kong.kongxinwei@hisilicon.com> Mime-Version: 1.0 Content-Type: multipart/signed; micalg=pgp-sha1; protocol="application/pgp-signature"; boundary="8GpibOaaTibBMecb" Return-path: Content-Disposition: inline In-Reply-To: <1431933109-22764-4-git-send-email-kong.kongxinwei@hisilicon.com> Sender: linux-pm-owner@vger.kernel.org To: Xinwei Kong Cc: rui.zhuang@intel.com, amit.kucheria@linaro.org, punit.agrawal@arm.com, Javi.Merino@arm.com, jorge.ramirez-ortiz@linaro.org, haojian.zhuang@linaro.org, linux-pm@vger.kernel.org, dan.zhao@hisilicon.com, devicetree@vger.kernel.org, gongyu@hisilicon.com, guodong.xu@linaro.org, robh@kernel.org, mark.rutland@arm.com, linuxarm@huawei.com, zhenwei.wang@hisilicon.com, leo.yan@linaro.org, mporter@konsulko.com, zhangfei.gao@linaro.org, liguozhu@hisilicon.com List-Id: devicetree@vger.kernel.org --8GpibOaaTibBMecb Content-Type: text/plain; charset=us-ascii Content-Disposition: inline Content-Transfer-Encoding: quoted-printable On Mon, May 18, 2015 at 03:11:49PM +0800, Xinwei Kong wrote: > From: kongxinwei >=20 > Dts includes two part: the first part is related with thermal sensor; > the second part is related with thermal zones, in this part it will > define the thermal zones and which sensor device should be bound to. > it also need specify the polling interval for every thermal zone. >=20 > Signed-off-by: Leo Yan > Signed-off-by: kongxinwei > --- > arch/arm64/boot/dts/hisilicon/hi6220.dtsi | 127 ++++++++++++++++++++++++= ++++++ > 1 file changed, 127 insertions(+) > create mode 100644 arch/arm64/boot/dts/hisilicon/hi6220.dtsi >=20 > diff --git a/arch/arm64/boot/dts/hisilicon/hi6220.dtsi b/arch/arm64/boot/= dts/hisilicon/hi6220.dtsi > new file mode 100644 > index 0000000..82f213d > --- /dev/null > +++ b/arch/arm64/boot/dts/hisilicon/hi6220.dtsi > @@ -0,0 +1,127 @@ > + > +#include > + > +/ { > + > + tsensor: tsensor@0,f7030700 { > + compatible =3D "hisilicon,tsensor"; > + reg =3D <0x0 0xf7030700 0x0 0x1000>; > + interrupts =3D <0 7 0x4>; > + clocks =3D <&clock_sys HI6220_TSENSOR_CLK>; > + clock-names =3D "thermal_clk"; > + #thermal-sensor-cells =3D <1>; > + > + thermal-zones { The thermal-zones node is typically in the root node, not inside the sensor node. > + local: local { > + /* milliseconds */ > + polling-delay-passive =3D <1000>; > + /* milliseconds */ > + polling-delay =3D <5000>; > + > + /* sensor ID */ > + thermal-sensors =3D <&tsensor 0>; > + > + trips { > + local_alert: local_alert { > + /* millicelsius */ > + temperature =3D <70000>; > + /* millicelsius */ > + hysteresis =3D <2000>; > + type =3D "passive"; > + }; > + local_crit: local_crit { > + temperature =3D <90000>; > + hysteresis =3D <2000>; > + type =3D "critical"; > + }; > + }; > + > + cooling-maps { > + /* There are currently no cooling maps > + because there are no cooling devices */ Not even cpufreq? in your driver you mention about cpufreq cooling. Do you have cpufreq-dt driver properly setup in your board? > + }; > + }; > + > + cluster1: cluster1 { > + polling-delay-passive =3D <1000>; > + polling-delay =3D <5000>; > + > + /* sensor ID */ > + thermal-sensors =3D <&tsensor 1>; > + > + trips { > + cluster1_alert: cluster1_alert { > + temperature =3D <70000>; > + hysteresis =3D <2000>; > + type =3D "passive"; > + }; > + cluster1_crit: cluster1_crit { > + temperature =3D <90000>; > + hysteresis =3D <2000>; > + type =3D "critical"; > + }; > + }; > + > + cooling-maps { > + /* There are currently no cooling maps > + because there are no cooling devices */ > + }; > + }; > + > + cluster0: cluster0 { > + polling-delay-passive =3D <1000>; > + polling-delay =3D <5000>; > + > + /* sensor ID */ > + thermal-sensors =3D <&tsensor 2>; > + > + trips { > + cluster0_alert: cluster0_alert { > + temperature =3D <70000>; > + hysteresis =3D <2000>; > + type =3D "passive"; > + }; > + cluster0_crit: cluster0_crit { > + temperature =3D <90000>; > + hysteresis =3D <2000>; > + type =3D "critical"; > + }; > + }; > + > + cooling-maps { > + map0 { > + trip =3D <&cluster0_alert>; > + cooling-device =3D > + <&cpu0 THERMAL_NO_LIMIT > + THERMAL_NO_LIMIT>; > + }; > + }; > + }; > + > + gpu: gpu { > + polling-delay-passive =3D <1000>; > + polling-delay =3D <5000>; > + > + /* sensor ID */ > + thermal-sensors =3D <&tsensor 3>; > + > + trips { > + gpu_alert: gpu_alert { > + temperature =3D <70000>; > + hysteresis =3D <2000>; > + type =3D "passive"; > + }; > + gpu_crit: gpu_crit { > + temperature =3D <90000>; > + hysteresis =3D <2000>; > + type =3D "critical"; > + }; > + }; > + > + cooling-maps { > + /* There are currently no cooling maps > + because there are no cooling devices */ > + }; > + }; > + }; > +} Are you sure this DT file works? I think it misses a closing \}. > --=20 > 1.9.1 >=20 >=20 --8GpibOaaTibBMecb Content-Type: application/pgp-signature; name="signature.asc" Content-Description: Digital signature -----BEGIN PGP SIGNATURE----- Version: GnuPG v1.4.12 (GNU/Linux) iQEcBAEBAgAGBQJVXBKxAAoJEMLUO4d9pOJWIqAH/2U0uIzoL1Udlv/gDeZd06px OqP5Tbkha1pkK9rwVdFt9zIx3wS6xjfDksDLbGisZ3xCd5pYJHEoGgB3U+7keaY5 6Etmi0zRmA3iwVpbpNQ8D5Noox45EVCP4WBKuTWnVNrT+bKhe+awMpWlnxTvT8fm ewVmoiOuAgxebWBVmVdy2Yntaoscovhk/mT8pFnL4e0OA7whA+XSxmhmqAMVY9FM mFVGlNCUzIhMHYxVRx/1rSTvWtEx2clThW5LIu6w9UtQEYfjIt9FCTRGY2Zqgshl jg97r4p3686vFa8AiwlnmKrZLwJtHlkJius7NUPwt8LEXYbpcxHqm9E/C/ZxMGU= =15Ss -----END PGP SIGNATURE----- --8GpibOaaTibBMecb--