Re: [PATCH v3 0/4] thermal: hisilicon: enable power allocator for Hi6220

[Leo Yan <leo.yan-QSEj5FYQhm4dnm+yROfE0A@public.gmane.org>]

On Tue, Mar 29, 2016 at 08:45:59AM -0700, Eduardo Valentin wrote:
> On Tue, Mar 29, 2016 at 07:27:11PM +0800, Leo Yan wrote:
> > Hi6220 has octa-core so it has quite high power consumption when run
> > benchmark and introduces high temperature for SoC. So need enable
> > thermal governor to control temperature and also cannot hurt much for
> > performance after impose cooling operations on CPU.
> > 
> > This patch series is to enable power allocator for Hi6220. Patch 1 is to
> > change "hysteresis" as optional property for trip points, so when enable
> > power allocator governor we can ignore this property.
> > 
> > During profiling also found two issues for thermal sensor's driver. The
> > power allocator just uses only one sensor, so patch 2 is to fix sensor
> > driver to let it can initialize driver successfully with only enabling
> > one sensor; patch 3 is to dismiss warning of IRQ imbalance enabling.
> > 
> > After profiling on Hikey, the power model has been simplized with only
> > dynamic coefficient, and now it's convienence to pass it from CPU node.
> > So patch 4 and 5 bind sensor and pass power model parameters.
> > 
> > This patch series have been tested on 96boards Hikey.
> 
> Applied patches 1 and 2 in my fixes branch. Patches 3 and 4 need to go
> via the hisi platform tree. You may add my
> 
> Acked-by: Eduardo Valentin <edubezval-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org>
> 
> on patches 3 and 4 if you want.

Thanks, Eduardo.

Hi Wei,

Could you help pick up patches 3/4 for enabling thermal in dts?

Thanks,
Leo Yan
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