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From: Mark Rutland <mark.rutland@arm.com>
To: Anurup M <anurupvasu@gmail.com>
Cc: dikshit.n@huawei.com, devicetree@vger.kernel.org,
	wangkefeng.wang@huawei.com, gabriele.paoloni@huawei.com,
	linux-arm-kernel@lists.infradead.org, john.garry@huawei.com,
	will.deacon@arm.com, linux-kernel@vger.kernel.org,
	xuwei5@hisilicon.com, linuxarm@huawei.com,
	zhangshaokun@hisilicon.com, robh+dt@kernel.org,
	sanil.kumar@hisilicon.com, huangdaode@hisilicon.com,
	shiju.jose@huawei.com, shyju.pv@huawei.com,
	tanxiaojun@huawei.com, anurup.m@huawei.com
Subject: Re: [PATCH v6 03/11] dt-bindings: perf: hisi: Add Devicetree bindings for Hisilicon SoC PMU
Date: Tue, 21 Mar 2017 17:28:20 +0000	[thread overview]
Message-ID: <20170321172819.GE29116@leverpostej> (raw)
In-Reply-To: <20170321140741.GD22188@leverpostej>

On Tue, Mar 21, 2017 at 02:07:42PM +0000, Mark Rutland wrote:
> On Fri, Mar 10, 2017 at 01:27:27AM -0500, Anurup M wrote:
> > +HiSilicon SoC chip is encapsulated by multiple CPU and IO dies. The CPU die
> > +is called as Super CPU cluster (SCCL) which includes 16 cpu-cores. Every SCCL
> > +in HiP05/06/07 chips are further grouped as CPU clusters (CCL) which includes
> > +4 cpu-cores each.
> > +e.g. In the case of HiP05/06/07, each SCCL has 1 L3 cache and 1 MN PMU device.
> > +The L3 cache is further grouped as 4 L3 cache banks in a SCCL.
> > +
> > +The Hisilicon SoC PMU DT node bindings for uncore PMU devices are as below.
> > +For PMU devices like L3 cache. MN etc. which are accessed using the djtag,
> > +the parent node will be the djtag node of the corresponding CPU die (SCCL).
> > +
> > +L3 cache
> > +---------
> > +The L3 cache is dedicated for each SCCL. Each SCCL in HiP05/06/07 chips have 4
> > +L3 cache banks. Each L3 cache bank have separate DT nodes.
> > +
> > +Required properties:
> > +
> > +	- compatible : This value should be as follows
> > +		(a) "hisilicon,hip05-pmu-l3c-v1" for v1 hw in HiP05 chipset
> > +		(b) "hisilicon,hip06-pmu-l3c-v1" for v1 hw in HiP06 chipset
> > +		(c) "hisilicon,hip07-pmu-l3c-v2" for v2 hw in HiP07 chipset
> > +
> > +	- hisilicon,module-id : This property is a combination of two values
> > +	    in the below order.
> > +		a) Module ID: The module identifier for djtag.
> > +		b) Instance or Bank ID: This will identify the L3 cache bank
> > +		 or instance.
> 
> I take it this is intended two mean this property is two cells in
> length, with one cell for each of the below.
> 
> This is a somewhat confusing proeprty given that the name only applies
> to the first half of the value...

Please split this itno two properties, and have a hisilicon,instance-id
for the L3 nodes.

Thanks,
Mark.

  reply	other threads:[~2017-03-21 17:28 UTC|newest]

Thread overview: 4+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2017-03-10  6:27 [PATCH v6 03/11] dt-bindings: perf: hisi: Add Devicetree bindings for Hisilicon SoC PMU Anurup M
2017-03-21 14:07 ` Mark Rutland
2017-03-21 17:28   ` Mark Rutland [this message]
2017-03-24 10:18     ` Anurup M

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