From mboxrd@z Thu Jan 1 00:00:00 1970 From: Eduardo Valentin Subject: Re: [PATCH RFC 2/3] thermal: dove: convert to a thermal OF sensor device Date: Sat, 1 Apr 2017 09:15:12 -0700 Message-ID: <20170401161510.GA18500@localhost.localdomain> References: Mime-Version: 1.0 Content-Type: text/plain; charset=iso-8859-1 Content-Transfer-Encoding: 8bit Return-path: Content-Disposition: inline In-Reply-To: Sender: linux-pm-owner@vger.kernel.org To: Russell King Cc: Jason Cooper , Andrew Lunn , Sebastian Hesselbarth , Gregory Clement , Rob Herring , Mark Rutland , Zhang Rui , linux-arm-kernel@lists.infradead.org, devicetree@vger.kernel.org, linux-pm@vger.kernel.org List-Id: devicetree@vger.kernel.org Russell, On Sun, Mar 12, 2017 at 07:07:45PM +0000, Russell King wrote: > Convert the dove thermal infrastructure to an OF sensor device, and add > the thermal zones for the SoC, with a critical trip point of 120°C. > This allows us to specify thermal zones and couple them to cooling > devices in DT. > > Signed-off-by: Russell King > --- > arch/arm/boot/dts/dove.dtsi | 17 +++++++++++++++++ > drivers/thermal/dove_thermal.c | 33 +++++++++++++++++++++++++-------- I have no opposition to these changes. The only request, to avoid conflicts, is to split the patch into driver and DTS changes. We have been pushing these separately. DTS changes go via the arch tree. Drivers changes goes via Rui/me. You can add my: Acked-by: Eduardo Valentin On the DTSI patch.