From mboxrd@z Thu Jan  1 00:00:00 1970
From: Eduardo Valentin <edubezval@gmail.com>
Subject: Re: [PATCH v2 2/2] ARM: dts: r8a7743: Add thermal device to DT
Date: Mon, 1 Jan 2018 12:11:58 -0800
Message-ID: <20180101201157.GB13596@localhost.localdomain>
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 <1513689449-2700-3-git-send-email-biju.das@bp.renesas.com>
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To: Biju Das <biju.das@bp.renesas.com>
Cc: Zhang Rui <rui.zhang@intel.com>, Rob Herring <robh+dt@kernel.org>, Mark Rutland <mark.rutland@arm.com>, Simon Horman <horms@verge.net.au>, Magnus Damm <magnus.damm@gmail.com>, Chris Paterson <chris.paterson2@renesas.com>, Fabrizio Castro <fabrizio.castro@bp.renesas.com>, devicetree@vger.kernel.org, linux-renesas-soc@vger.kernel.org, linux-pm@vger.kernel.org
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On Tue, Dec 19, 2017 at 01:17:29PM +0000, Biju Das wrote:
> This patch instantiates the thermal sensor module with thermal-zone
> support.
> 
> This patch is based on the commit cac68a56e34b
> ("ARM: dts: r8a7791: enable to use thermal-zone") by Kuninori Morimoto.
> 
> Signed-off-by: Biju Das <biju.das@bp.renesas.com>
> Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>

As for the thermal composition of this patch:
Acked-by: Eduardo Valentin <edubezval@gmail.com>

Also taking care of patch 1.