From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Date: Tue, 30 Oct 2018 16:44:41 -0500 From: Rob Herring Subject: Re: [PATCH v2 4/4] dt-bindings: iio: magn: add LSM9DS1 bindings Message-ID: <20181030214441.GA25441@bogus> References: <20181026023812.29720-1-martin@martingkelly.com> <20181026023812.29720-4-martin@martingkelly.com> <20181028185308.20edd4f3@archlinux> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <20181028185308.20edd4f3@archlinux> To: Jonathan Cameron Cc: Martin Kelly , linux-iio@vger.kernel.org, devicetree@vger.kernel.org, Lorenzo Bianconi , Denis Ciocca List-ID: On Sun, Oct 28, 2018 at 06:53:08PM +0000, Jonathan Cameron wrote: > On Thu, 25 Oct 2018 19:38:12 -0700 > Martin Kelly wrote: > > > From: Martin Kelly > > > > Add DT binding documentation for the LSM9DS1 magnetometer driver. Bindings are for h/w, not drivers. > > > > Signed-off-by: Martin Kelly > Given here isn't really an alternative way of doing this (or we > haven't come up with one yet) in the sensors that are basically multiple > chips in one package, I'll hope that Rob is happy with the new name > and apply it. As I'm only pushing out for build tests today I can > revert or add his Reviewed-by as needed. Given only the supplies seem to be shared and those can be handled correctly with ref counting, separate devices is fine. We do the same thing for BT/WiFi combo chips with separate host interfaces. Reviewed-by: Rob Herring Rob