From mboxrd@z Thu Jan 1 00:00:00 1970 From: Maxime Ripard Subject: Re: [PATCH v2 0/2] add thermal driver for h6 Date: Fri, 17 May 2019 09:43:50 +0200 Message-ID: <20190517074350.m4wtxn5rgiqkjgnz@flea> References: <20190516172633.12607-1-tiny.windzz@gmail.com> Mime-Version: 1.0 Content-Type: multipart/signed; micalg=pgp-sha256; protocol="application/pgp-signature"; boundary="uiqnaa7feozmkfnb" Return-path: Content-Disposition: inline In-Reply-To: <20190516172633.12607-1-tiny.windzz@gmail.com> Sender: linux-kernel-owner@vger.kernel.org To: Yangtao Li Cc: rui.zhang@intel.com, edubezval@gmail.com, daniel.lezcano@linaro.org, robh+dt@kernel.org, mark.rutland@arm.com, wens@csie.org, davem@davemloft.net, mchehab+samsung@kernel.org, gregkh@linuxfoundation.org, linus.walleij@linaro.org, Jonathan.Cameron@huawei.com, nicolas.ferre@microchip.com, paulmck@linux.ibm.com, linux-pm@vger.kernel.org, devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org List-Id: devicetree@vger.kernel.org --uiqnaa7feozmkfnb Content-Type: text/plain; charset=us-ascii Content-Disposition: inline Hi, On Thu, May 16, 2019 at 01:26:31PM -0400, Yangtao Li wrote: > This patchset supprt H6 thermal controller. The discussion is still ongoing on the v1, it would have been better to wait a bit on it to settle before sending a new version. Anyway, some comment made there still apply. Maxime -- Maxime Ripard, Bootlin Embedded Linux and Kernel engineering https://bootlin.com --uiqnaa7feozmkfnb Content-Type: application/pgp-signature; name="signature.asc" -----BEGIN PGP SIGNATURE----- iHUEABYIAB0WIQRcEzekXsqa64kGDp7j7w1vZxhRxQUCXN5mNgAKCRDj7w1vZxhR xdGaAQDw2HatyDwe99md5xjAb+SPPeYer/Zb4obBMYGlhQuO9AEAkn/HI2qNYsxw /7OQTPnikOxNibnfTB1JZq1yrq3HeAs= =fhoH -----END PGP SIGNATURE----- --uiqnaa7feozmkfnb--