devicetree.vger.kernel.org archive mirror
 help / color / mirror / Atom feed
From: mgross@linux.intel.com
To: markgross@kernel.org, mgross@linux.intel.com, arnd@arndb.de,
	bp@suse.de, damien.lemoal@wdc.com, dragan.cvetic@xilinx.com,
	gregkh@linuxfoundation.org, corbet@lwn.net,
	palmerdabbelt@google.com, paul.walmsley@sifive.com,
	peng.fan@nxp.com, robh+dt@kernel.org, shawnguo@kernel.org,
	jassisinghbrar@gmail.com
Cc: linux-kernel@vger.kernel.org, "C,
	Udhayakumar" <udhayakumar.c@intel.com>,
	devicetree@vger.kernel.org
Subject: [PATCH v4 26/34] dt-bindings: misc: intel_tsens: Add tsens thermal bindings documentation
Date: Fri, 29 Jan 2021 18:21:16 -0800	[thread overview]
Message-ID: <20210130022124.65083-62-mgross@linux.intel.com> (raw)
In-Reply-To: <20210130022124.65083-1-mgross@linux.intel.com>

From: "C, Udhayakumar" <udhayakumar.c@intel.com>

Add device tree bindings for local host thermal sensors
Intel Edge.AI Computer Vision platforms.

The tsens module enables reading of on chip sensors present
in the Intel Bay series SoC. In the tsens module various junction
temperature and SoC temperature are reported using thermal subsystem
and i2c subsystem.

Temperature data reported using thermal subsystem will be used for
various cooling agents such as DVFS, fan control and shutdown the
system in case of critical temperature.

Temperature data reported using i2c subsytem will be used by
platform manageability software running in remote host.

Cc: Rob Herring <robh+dt@kernel.org>
Cc: devicetree@vger.kernel.org
Acked-by: mark gross <mgross@linux.intel.com>
Signed-off-by: C Udhayakumar <udhayakumar.c@intel.com>
Signed-off-by: Mark Gross <mgross@linux.intel.com>
---
 .../bindings/misc/intel,intel-tsens.yaml      | 118 ++++++++++++++++++
 1 file changed, 118 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/misc/intel,intel-tsens.yaml

diff --git a/Documentation/devicetree/bindings/misc/intel,intel-tsens.yaml b/Documentation/devicetree/bindings/misc/intel,intel-tsens.yaml
new file mode 100644
index 000000000000..2418355d9c47
--- /dev/null
+++ b/Documentation/devicetree/bindings/misc/intel,intel-tsens.yaml
@@ -0,0 +1,118 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: "http://devicetree.org/schemas/misc/intel,intel-tsens.yaml#"
+$schema: "http://devicetree.org/meta-schemas/core.yaml#"
+
+title: Intel Temperature sensors in Bay series
+
+maintainers:
+  - Udhayakumar C <udhayakumar.c@intel.com>
+
+description: |
+  The tsens driver enables reading of onchip sensors present
+  in the Intel Bay SoC.
+  Each subnode of the tsens represents sensors available
+  on the soc.
+
+select: false
+
+properties:
+  compatible:
+    items:
+      - const: intel,intel-tsens
+
+  plat_name:
+    contains:
+      enum:
+        - intel,keembay_thermal
+
+  reg:
+    minItems: 1
+    maxItems: 2
+
+  clocks:
+    items:
+      - description: thermal sensor clock
+
+  clk-rate:
+    additionalItems: false
+    items:
+      - description: thermal sensor clock freq
+
+  sensor_name:
+    type: object
+    description:
+      Details to configure sensor trip points and its types.
+
+    properties:
+      passive_delay:
+        minItems: 1
+        maxItems: 1
+        description: number of milliseconds to wait between polls when
+                     performing passive cooling
+
+      polling_delay:
+        minItems: 1
+        maxItems: 1
+        description: number of milliseconds to wait between polls when checking
+                     whether trip points have been crossed (0 for interrupt
+                     driven systems)
+
+      trip_temp:
+        minItems: 1
+        description: temperature for trip points
+
+      trip_type:
+        minItems: 1
+        description: trip type list for trip points
+
+    required:
+      - passive_delay
+      - polling_delay
+      - trip_temp
+      - trip_type
+
+required:
+  - compatible
+
+additionalProperties: false
+
+examples:
+  - |
+    tsens: tsens@20260000 {
+        compatible = "intel,intel-tsens";
+        status = "disabled";
+        plat_name = "intel,keembay_thermal";
+        reg = <0x0 0x20260000 0x0 0x100>;
+        clocks = <&scmi_clk>;
+        clk-rate = <1250000>;
+
+        mss {
+                passive_delay = <1000>;
+                polling_delay = <2000>;
+                trip_temp = <40000 80000 1000000>;
+                trip_type = "passive", "passive", "critical";
+        };
+
+        css {
+                passive_delay = <1000>;
+                polling_delay = <2000>;
+                trip_temp = <40000 80000 1000000>;
+                trip_type = "passive", "passive", "critical";
+        };
+
+        nce {
+                passive_delay = <1000>;
+                polling_delay = <2000>;
+                trip_temp = <40000 80000 1000000>;
+                trip_type = "passive", "passive", "critical";
+        };
+
+        soc {
+                passive_delay = <1000>;
+                polling_delay = <2000>;
+                trip_temp = <40000 80000 1000000>;
+                trip_type = "passive", "passive", "critical";
+        };
+     };
-- 
2.17.1


  parent reply	other threads:[~2021-01-30 10:04 UTC|newest]

Thread overview: 16+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
     [not found] <20210130022124.65083-1-mgross@linux.intel.com>
2021-01-30  2:20 ` [PATCH v3 04/34] dt-bindings: Add bindings for Keem Bay IPC driver mgross
2021-01-30  2:20 ` [PATCH v3 06/34] dt-bindings: Add bindings for Keem Bay VPU " mgross
2021-01-30  2:20 ` [PATCH v3 17/34] xlink-ipc: Add xlink ipc device tree bindings mgross
2021-01-30  2:20 ` [PATCH v3 19/34] xlink-core: Add xlink core " mgross
2021-01-30  2:20 ` [PATCH v4 02/34] dt-bindings: mailbox: Add Intel VPU IPC mailbox bindings mgross
2021-01-30  2:20 ` [PATCH v4 04/34] dt-bindings: Add bindings for Keem Bay IPC driver mgross
2021-01-30  2:20 ` [PATCH v4 06/34] dt-bindings: Add bindings for Keem Bay VPU " mgross
2021-01-30  2:21 ` [PATCH v4 17/34] xlink-ipc: Add xlink ipc device tree bindings mgross
2021-01-30  2:21 ` [PATCH v4 19/34] xlink-core: Add xlink core " mgross
2021-01-30  2:21 ` [PATCH v4 24/34] dt-bindings: misc: Add Keem Bay vpumgr mgross
2021-01-30  2:21 ` mgross [this message]
2021-01-30 17:23   ` [PATCH v4 26/34] dt-bindings: misc: intel_tsens: Add tsens thermal bindings documentation Rob Herring
2021-02-02  8:47     ` C, Udhayakumar
2021-01-30  2:21 ` [PATCH v4 32/34] dt-bindings: misc: hddl_dev: Add hddl device management documentation mgross
2021-01-30 17:23   ` Rob Herring
2021-02-02  8:48     ` C, Udhayakumar

Reply instructions:

You may reply publicly to this message via plain-text email
using any one of the following methods:

* Save the following mbox file, import it into your mail client,
  and reply-to-all from there: mbox

  Avoid top-posting and favor interleaved quoting:
  https://en.wikipedia.org/wiki/Posting_style#Interleaved_style

* Reply using the --to, --cc, and --in-reply-to
  switches of git-send-email(1):

  git send-email \
    --in-reply-to=20210130022124.65083-62-mgross@linux.intel.com \
    --to=mgross@linux.intel.com \
    --cc=arnd@arndb.de \
    --cc=bp@suse.de \
    --cc=corbet@lwn.net \
    --cc=damien.lemoal@wdc.com \
    --cc=devicetree@vger.kernel.org \
    --cc=dragan.cvetic@xilinx.com \
    --cc=gregkh@linuxfoundation.org \
    --cc=jassisinghbrar@gmail.com \
    --cc=linux-kernel@vger.kernel.org \
    --cc=markgross@kernel.org \
    --cc=palmerdabbelt@google.com \
    --cc=paul.walmsley@sifive.com \
    --cc=peng.fan@nxp.com \
    --cc=robh+dt@kernel.org \
    --cc=shawnguo@kernel.org \
    --cc=udhayakumar.c@intel.com \
    /path/to/YOUR_REPLY

  https://kernel.org/pub/software/scm/git/docs/git-send-email.html

* If your mail client supports setting the In-Reply-To header
  via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line before the message body.
This is a public inbox, see mirroring instructions
for how to clone and mirror all data and code used for this inbox;
as well as URLs for NNTP newsgroup(s).