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Date: Mon, 25 Sep 2023 11:42:10 +0800
From: Shawn Guo <shawnguo@kernel.org>
To: Marek Vasut <marex@denx.de>
Cc: linux-arm-kernel@lists.infradead.org,
	Conor Dooley <conor+dt@kernel.org>,
	Fabio Estevam <festevam@gmail.com>,
	Frieder Schrempf <frieder.schrempf@kontron.de>,
	Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
	NXP Linux Team <linux-imx@nxp.com>, Peng Fan <peng.fan@nxp.com>,
	Pengutronix Kernel Team <kernel@pengutronix.de>,
	Rob Herring <robh+dt@kernel.org>,
	Sascha Hauer <s.hauer@pengutronix.de>, devicetree@vger.kernel.org
Subject: Re: [PATCH 1/2] arm64: dts: imx8mp: Update i.MX8MP DHCOM SoM DT to
 production rev.200
Message-ID: <20230925034210.GJ7231@dragon>
References: <20230921192933.71639-1-marex@denx.de>
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In-Reply-To: <20230921192933.71639-1-marex@denx.de>

On Thu, Sep 21, 2023 at 09:29:32PM +0200, Marek Vasut wrote:
> The current imx8mp-dhcom-som.dtsi describes prototype rev.100 SoM,
> update the DT to describe production rev.200 SoM which brings the
> following changes:
> - Fast SoC GPIOs exposed on the SoM edge connector
> - Slow GPIOs like component resets moved to I2C GPIO expander
> - ADC upgraded from TLA2024 to ADS1015 with conversion interrupt
> - EEPROM size increased from 256 B to 4 kiB
> 
> Signed-off-by: Marek Vasut <marex@denx.de>

Hmm, it doesn't apply to my imx/dt64 branch.

Shawn