From mboxrd@z Thu Jan 1 00:00:00 1970 Received: from smtp.kernel.org (aws-us-west-2-korg-mail-1.web.codeaurora.org [10.30.226.201]) (using TLSv1.2 with cipher ECDHE-RSA-AES256-GCM-SHA384 (256/256 bits)) (No client certificate requested) by smtp.subspace.kernel.org (Postfix) with ESMTPS id C84E417990 for ; Sun, 1 Oct 2023 15:57:18 +0000 (UTC) Received: by smtp.kernel.org (Postfix) with ESMTPSA id 0FE8AC433C7; Sun, 1 Oct 2023 15:57:09 +0000 (UTC) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/simple; d=kernel.org; s=k20201202; t=1696175838; bh=sCovQZwExo44oQAqhqDPGoISPRpG+C8reMc7OEyCOXY=; h=Date:From:To:Cc:Subject:References:In-Reply-To:From; b=BtKEt3E76UzpTLf5SYgOHMPnuM9hGikPj+SBjDplOal6PvPDG61/dZuoKnIWIfcV/ c7Gn7oRXGV0CTPji+zy/KVq5ZTTbUurFzpfWNJeNiANrTSci1FC8LOSNztr67HQG8f zxkXb2FUW0G3w+2lzDgISRAWAcsOPU9c0/mirdUcUpbByuPiYJU7K+QbSALwqHXJfH CM+IDcbEpvke6eVjQ5ojcVqaCwFRsNhP15XcPQCIejj5b2xutWZu5fgsMsSZP739GJ Z64PuthHnxiacO7qE5fJPjC/GfK734diyZa8NP13R6BjodgAmtTyGfe/kiE+Rwc5Y2 7RfFb9TXs9RAQ== Date: Sun, 1 Oct 2023 21:27:01 +0530 From: Manivannan Sadhasivam To: Caleb Connolly Cc: Andy Gross , Bhupesh Sharma , Bjorn Andersson , Konrad Dybcio , Mathieu Poirier , Rob Herring , Krzysztof Kozlowski , Conor Dooley , "Rafael J. Wysocki" , Daniel Lezcano , Amit Kucheria , Zhang Rui , Sibi Sankar , Manivannan Sadhasivam , Thara Gopinath , linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org, devicetree@vger.kernel.org, linux-pm@vger.kernel.org Subject: Re: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Message-ID: <20231001155701.GA53767@thinkpad> References: <20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org> Precedence: bulk X-Mailing-List: devicetree@vger.kernel.org List-Id: List-Subscribe: List-Unsubscribe: MIME-Version: 1.0 Content-Type: text/plain; charset=utf-8 Content-Disposition: inline Content-Transfer-Encoding: 8bit In-Reply-To: <20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org> On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote: > The Thermal Mitigation Device (TMD) Service is a QMI service that runs > on remote subsystems (the modem and DSPs) on Qualcomm SoCs. > It exposes various mitigations including passive thermal controls and > rail voltage restrictions. > > This series introduces support for exposing TMDs as cooling devices > in the kernel through the thermal framework, using the QMI interface. > > Each TMD client is described as a child of the remoteproc node in > devicetree. With subnodes for each control. > Daniel expressed concerns in the past aganist representing TMD driver as a cooling device since it is not tied to thermal zones and the governors cannot use it. Instead he suggested to represent it as a powercap device with thermal constraints. So please look into that approach. - Mani > This series is based on previous work by Bhupesh Sharma which can be > found at [1]. I'm sending this as a fresh series as it has been a > year since the original version and I have rewritten most of the driver. > > [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@linaro.org/ > > --- > Caleb Connolly (4): > remoteproc: qcom: probe all child devices > dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings > thermal: qcom: add qmi-cooling driver > MAINTAINERS: Add entry for Qualcomm Cooling Driver > > .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 + > .../bindings/remoteproc/qcom,pas-common.yaml | 6 + > .../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++ > MAINTAINERS | 8 + > drivers/remoteproc/qcom_q6v5.c | 4 + > drivers/remoteproc/qcom_q6v5_mss.c | 8 - > drivers/thermal/qcom/Kconfig | 13 + > drivers/thermal/qcom/Makefile | 1 + > drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++ > drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++ > 10 files changed, 1161 insertions(+), 8 deletions(-) > --- > base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812 > > // Caleb (they/them) > -- மணிவண்ணன் சதாசிவம்