From: Bjorn Andersson <quic_bjorande@quicinc.com>
To: Bjorn Andersson <andersson@kernel.org>,
Konrad Dybcio <konrad.dybcio@linaro.org>,
Greg Kroah-Hartman <gregkh@linuxfoundation.org>,
Rob Herring <robh+dt@kernel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
Conor Dooley <conor+dt@kernel.org>,
Wesley Cheng <quic_wcheng@quicinc.com>,
Thinh Nguyen <Thinh.Nguyen@synopsys.com>,
Felipe Balbi <balbi@kernel.org>,
Philipp Zabel <p.zabel@pengutronix.de>
Cc: <linux-arm-msm@vger.kernel.org>, <linux-usb@vger.kernel.org>,
<devicetree@vger.kernel.org>, <linux-kernel@vger.kernel.org>,
Johan Hovold <johan@kernel.org>,
Krishna Kurapati PSSNV <quic_kriskura@quicinc.com>,
"Bjorn Andersson" <quic_bjorande@quicinc.com>
Subject: [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue"
Date: Mon, 16 Oct 2023 20:11:17 -0700 [thread overview]
Message-ID: <20231016-dwc3-refactor-v1-9-ab4a84165470@quicinc.com> (raw)
In-Reply-To: <20231016-dwc3-refactor-v1-0-ab4a84165470@quicinc.com>
The Qualcomm USB block consists of three intertwined parts, the XHCI,
the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents
the Qualcomm glue part, with the other two represented as in a child
node.
Rename the qcom,dwc3 binding, to represent that this is indeed only the
glue part, to make room for a combined binding.
The large "select" is included to avoid the schema to be selected for
validation with the upcoming flattened binding - which includes
snps,dwc3 in the compatible.
Signed-off-by: Bjorn Andersson <quic_bjorande@quicinc.com>
---
.../usb/{qcom,dwc3.yaml => qcom,dwc3-glue.yaml} | 54 +++++++++++++++++++++-
1 file changed, 52 insertions(+), 2 deletions(-)
diff --git a/Documentation/devicetree/bindings/usb/qcom,dwc3.yaml b/Documentation/devicetree/bindings/usb/qcom,dwc3-glue.yaml
similarity index 89%
rename from Documentation/devicetree/bindings/usb/qcom,dwc3.yaml
rename to Documentation/devicetree/bindings/usb/qcom,dwc3-glue.yaml
index 727abe41c422..bec0151b41d2 100644
--- a/Documentation/devicetree/bindings/usb/qcom,dwc3.yaml
+++ b/Documentation/devicetree/bindings/usb/qcom,dwc3-glue.yaml
@@ -1,14 +1,64 @@
# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
%YAML 1.2
---
-$id: http://devicetree.org/schemas/usb/qcom,dwc3.yaml#
+$id: http://devicetree.org/schemas/usb/qcom,dwc3-glue.yaml#
$schema: http://devicetree.org/meta-schemas/core.yaml#
-title: Qualcomm SuperSpeed DWC3 USB SoC controller
+title: Qualcomm SuperSpeed DWC3 USB SoC controller glue
+
+description:
+ This describes the Qualcomm glue-section of the SuperSpeed DWC3 USB
+ controller found in many Qualcomm platforms, with the XHCI and DWC3 core
+ portions described as a separate child device.
+ The combined representation, defined by qcom,dwc3.yaml is preferred.
maintainers:
- Wesley Cheng <quic_wcheng@quicinc.com>
+select:
+ properties:
+ compatible:
+ items:
+ - enum:
+ - qcom,ipq4019-dwc3
+ - qcom,ipq5018-dwc3
+ - qcom,ipq5332-dwc3
+ - qcom,ipq6018-dwc3
+ - qcom,ipq8064-dwc3
+ - qcom,ipq8074-dwc3
+ - qcom,ipq9574-dwc3
+ - qcom,msm8953-dwc3
+ - qcom,msm8994-dwc3
+ - qcom,msm8996-dwc3
+ - qcom,msm8998-dwc3
+ - qcom,qcm2290-dwc3
+ - qcom,qcs404-dwc3
+ - qcom,sa8775p-dwc3
+ - qcom,sc7180-dwc3
+ - qcom,sc7280-dwc3
+ - qcom,sc8180x-dwc3
+ - qcom,sc8280xp-dwc3
+ - qcom,sc8280xp-dwc3-mp
+ - qcom,sdm660-dwc3
+ - qcom,sdm670-dwc3
+ - qcom,sdm845-dwc3
+ - qcom,sdx55-dwc3
+ - qcom,sdx65-dwc3
+ - qcom,sdx75-dwc3
+ - qcom,sm4250-dwc3
+ - qcom,sm6115-dwc3
+ - qcom,sm6125-dwc3
+ - qcom,sm6350-dwc3
+ - qcom,sm6375-dwc3
+ - qcom,sm8150-dwc3
+ - qcom,sm8250-dwc3
+ - qcom,sm8350-dwc3
+ - qcom,sm8450-dwc3
+ - qcom,sm8550-dwc3
+ - const: qcom,dwc3
+ required:
+ - compatible
+
properties:
compatible:
items:
--
2.25.1
next prev parent reply other threads:[~2023-10-17 3:11 UTC|newest]
Thread overview: 42+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-10-17 3:11 [PATCH 00/12] usb: dwc3: qcom: Flatten dwc3 structure Bjorn Andersson
2023-10-17 3:11 ` [PATCH 01/12] dt-bindings: usb: qcom,dwc3: Add qcom,sc8180x-dwc3 Bjorn Andersson
2023-10-17 6:03 ` Krzysztof Kozlowski
2023-10-17 3:11 ` [PATCH 02/12] usb: dwc3: qcom: Rename dwc3 platform_device reference Bjorn Andersson
2023-10-17 16:08 ` Konrad Dybcio
2023-11-22 9:58 ` Johan Hovold
2023-10-17 3:11 ` [PATCH 03/12] usb: dwc3: qcom: Merge resources from urs_usb device Bjorn Andersson
2023-10-20 6:02 ` kernel test robot
2023-11-22 10:24 ` Johan Hovold
2024-01-08 16:25 ` Bjorn Andersson
2023-10-17 3:11 ` [PATCH 04/12] usb: dwc3: Expose core driver as library Bjorn Andersson
2023-10-20 22:18 ` Thinh Nguyen
2023-11-22 11:57 ` Johan Hovold
2024-01-08 16:42 ` Bjorn Andersson
2023-10-17 3:11 ` [PATCH 05/12] usb: dwc3: Override end of dwc3 memory resource Bjorn Andersson
2023-10-17 16:14 ` Konrad Dybcio
2023-10-20 22:07 ` Thinh Nguyen
2023-10-17 3:11 ` [PATCH 06/12] usb: dwc3: qcom: Add dwc3 core reference in driver state Bjorn Andersson
2023-11-22 12:18 ` Johan Hovold
2024-01-08 18:02 ` Bjorn Andersson
2023-10-17 3:11 ` [PATCH 07/12] usb: dwc3: qcom: Instantiate dwc3 core directly Bjorn Andersson
2023-11-22 12:23 ` Johan Hovold
2024-01-10 3:16 ` Krishna Kurapati PSSNV
2023-10-17 3:11 ` [PATCH 08/12] usb: dwc3: qcom: Inline the qscratch constants Bjorn Andersson
2023-10-17 16:18 ` Konrad Dybcio
2023-10-17 3:11 ` Bjorn Andersson [this message]
2023-10-17 6:05 ` [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue" Krzysztof Kozlowski
2023-11-22 12:25 ` Johan Hovold
2023-10-17 3:11 ` [PATCH 10/12] dt-bindings: usb: qcom,dwc3: Introduce flattened qcom,dwc3 binding Bjorn Andersson
2023-10-17 6:11 ` Krzysztof Kozlowski
2023-10-17 22:54 ` Bjorn Andersson
2023-10-18 6:00 ` Krzysztof Kozlowski
2023-10-17 18:31 ` Rob Herring
2023-10-17 21:02 ` Bjorn Andersson
2023-11-22 12:40 ` Johan Hovold
2023-10-17 3:11 ` [PATCH 11/12] usb: dwc3: qcom: Flatten the Qualcomm dwc3 binding and implementation Bjorn Andersson
2024-01-10 3:13 ` Krishna Kurapati PSSNV
2024-01-10 19:23 ` Bjorn Andersson
2023-10-17 3:11 ` [PATCH 12/12] arm64: dts: qcom: sc8180x: flatten usb_sec node Bjorn Andersson
2023-10-20 22:04 ` [PATCH 00/12] usb: dwc3: qcom: Flatten dwc3 structure Thinh Nguyen
2023-11-22 9:48 ` Johan Hovold
2024-01-08 16:46 ` Bjorn Andersson
Reply instructions:
You may reply publicly to this message via plain-text email
using any one of the following methods:
* Save the following mbox file, import it into your mail client,
and reply-to-all from there: mbox
Avoid top-posting and favor interleaved quoting:
https://en.wikipedia.org/wiki/Posting_style#Interleaved_style
* Reply using the --to, --cc, and --in-reply-to
switches of git-send-email(1):
git send-email \
--in-reply-to=20231016-dwc3-refactor-v1-9-ab4a84165470@quicinc.com \
--to=quic_bjorande@quicinc.com \
--cc=Thinh.Nguyen@synopsys.com \
--cc=andersson@kernel.org \
--cc=balbi@kernel.org \
--cc=conor+dt@kernel.org \
--cc=devicetree@vger.kernel.org \
--cc=gregkh@linuxfoundation.org \
--cc=johan@kernel.org \
--cc=konrad.dybcio@linaro.org \
--cc=krzysztof.kozlowski+dt@linaro.org \
--cc=linux-arm-msm@vger.kernel.org \
--cc=linux-kernel@vger.kernel.org \
--cc=linux-usb@vger.kernel.org \
--cc=p.zabel@pengutronix.de \
--cc=quic_kriskura@quicinc.com \
--cc=quic_wcheng@quicinc.com \
--cc=robh+dt@kernel.org \
/path/to/YOUR_REPLY
https://kernel.org/pub/software/scm/git/docs/git-send-email.html
* If your mail client supports setting the In-Reply-To header
via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line
before the message body.
This is a public inbox, see mirroring instructions
for how to clone and mirror all data and code used for this inbox;
as well as URLs for NNTP newsgroup(s).