From: sashiko-bot@kernel.org
To: "Rosen Penev" <rosenp@gmail.com>
Cc: devicetree@vger.kernel.org, robh@kernel.org, conor+dt@kernel.org
Subject: Re: [PATCH 4/4] ARM: dts: helios4: wire LM75 into a thermal zone with fan cooling
Date: Sun, 28 Jun 2026 23:13:17 +0000 [thread overview]
Message-ID: <20260628231318.6736C1F000E9@smtp.kernel.org> (raw)
In-Reply-To: <20260628230042.1204293-5-rosenp@gmail.com>
Thank you for your contribution! Sashiko AI review found 3 potential issue(s) to consider:
- [High] The `pwm-fan` nodes (`fan1` and `fan2`) are missing the `cooling-levels` property, rendering the dynamic thermal fan cooling entirely non-functional.
- [Low] The `#thermal-sensor-cells` property is added to the LM75 node without documenting it in the `lm75.yaml` DT binding schema.
- [Low] The `board_alert` trip point incorrectly uses `type = "passive"` for active cooling fans.
--
commit 1aed98d24fa9eab58f80e2422b885b0e44e17d12
Author: Rosen Penev <rosenp@gmail.com>
ARM: dts: helios4: wire LM75 into a thermal zone with fan cooling
The LM75 temperature sensor on i2c0 creates a hwmon interface but was
not referenced by any thermal zone. This patch wires it into a thermal
zone with fan cooling maps.
> diff --git a/arch/arm/boot/dts/marvell/armada-388-helios4.dts b/arch/arm/boot/dts/marvell/armada-388-helios4.dts
> index 003b0708e9656..51675646ec397 100644
> --- a/arch/arm/boot/dts/marvell/armada-388-helios4.dts
> +++ b/arch/arm/boot/dts/marvell/armada-388-helios4.dts
[ ... ]
> @@ -68,6 +69,35 @@ reg_5p0v_usb: regulator-5v-usb {
> vin-supply = <®_12v>;
> };
>
> + thermal-zones {
> + board-thermal {
> + polling-delay-passive = <2000>;
> + polling-delay = <10000>;
> + thermal-sensors = <&temp_sensor>;
> +
> + trips {
> + board_alert: board-alert {
> + temperature = <55000>;
> + hysteresis = <5000>;
> + type = "passive";
[Severity: Low]
Does this trip type match the intended use for active cooling fans?
The thermal-zones.yaml device tree binding explicitly designates type = active
for fans and type = passive for CPU throttling. By using passive, the thermal
framework will use polling-delay-passive intervals instead of standard active
cooling intervals.
> + };
[ ... ]
> @@ -129,6 +159,7 @@ fan1: j10-pwm {
> pwms = <&gpio1 9 40000>; /* Target freq:25 kHz */
> pinctrl-names = "default";
> pinctrl-0 = <&helios_fan1_pins>;
> + #cooling-cells = <2>;
[Severity: High]
Is the required cooling-levels property missing from this fan node?
Without cooling-levels defined in the pwm-fan nodes, the driver's
pwm_fan_get_cooling_data() in drivers/hwmon/pwm-fan.c returns early.
This leaves pwm_fan_max_state at 0, causing the driver to set the fans to a
100% duty cycle and register the cooling device with a max state of 0. When
the thermal governor attempts to change the state, it can only request state
0, leaving the fan permanently at full speed.
> };
>
> fan2: j17-pwm {
> @@ -136,6 +167,7 @@ fan2: j17-pwm {
> pwms = <&gpio1 23 40000>; /* Target freq:25 kHz */
> pinctrl-names = "default";
> pinctrl-0 = <&helios_fan2_pins>;
> + #cooling-cells = <2>;
[Severity: High]
Will this fan also need the cooling-levels property to be controlled by the
thermal zone?
Without the property, the same issue as above will prevent the thermal
governor from adjusting this fan's speed.
> };
[ ... ]
> @@ -201,6 +233,7 @@ temp_sensor: temp@4c {
> compatible = "ti,lm75";
> reg = <0x4c>;
> vcc-supply = <®_3p3v>;
> + #thermal-sensor-cells = <0>;
[Severity: Low]
Should the LM75 device tree binding schema be updated to document this new
provider capability?
Adding an undocumented capability causes dtbs_check schema validation errors
or warnings. The Documentation/devicetree/bindings/hwmon/lm75.yaml file needs
to be updated to include #thermal-sensor-cells.
> };
--
Sashiko AI review · https://sashiko.dev/#/patchset/20260628230042.1204293-1-rosenp@gmail.com?part=4
prev parent reply other threads:[~2026-06-28 23:13 UTC|newest]
Thread overview: 6+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-06-28 23:00 [PATCH 0/4] ARM: dts: helios4: add regulator supplies and thermal cooling Rosen Penev
2026-06-28 23:00 ` [PATCH 1/4] ARM: dts: helios4: add vcc-supply to EEPROM Rosen Penev
2026-06-28 23:00 ` [PATCH 2/4] ARM: dts: helios4: add vcc-supply to GPIO expander Rosen Penev
2026-06-28 23:00 ` [PATCH 3/4] ARM: dts: helios4: add SATA regulator supplies Rosen Penev
2026-06-28 23:00 ` [PATCH 4/4] ARM: dts: helios4: wire LM75 into a thermal zone with fan cooling Rosen Penev
2026-06-28 23:13 ` sashiko-bot [this message]
Reply instructions:
You may reply publicly to this message via plain-text email
using any one of the following methods:
* Save the following mbox file, import it into your mail client,
and reply-to-all from there: mbox
Avoid top-posting and favor interleaved quoting:
https://en.wikipedia.org/wiki/Posting_style#Interleaved_style
* Reply using the --to, --cc, and --in-reply-to
switches of git-send-email(1):
git send-email \
--in-reply-to=20260628231318.6736C1F000E9@smtp.kernel.org \
--to=sashiko-bot@kernel.org \
--cc=conor+dt@kernel.org \
--cc=devicetree@vger.kernel.org \
--cc=robh@kernel.org \
--cc=rosenp@gmail.com \
--cc=sashiko-reviews@lists.linux.dev \
/path/to/YOUR_REPLY
https://kernel.org/pub/software/scm/git/docs/git-send-email.html
* If your mail client supports setting the In-Reply-To header
via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line
before the message body.
This is a public inbox, see mirroring instructions
for how to clone and mirror all data and code used for this inbox