From: sashiko-bot@kernel.org
To: "Binbin Zhou" <zhoubinbin@loongson.cn>
Cc: conor+dt@kernel.org, mfd@lists.linux.dev, robh@kernel.org,
lee@kernel.org, devicetree@vger.kernel.org
Subject: Re: [PATCH v3 3/5] dt-bindings: mfd: syscon: Allow syscon compatible for Loongson-2K0300 chip id
Date: Fri, 31 Jul 2026 09:45:34 +0000 [thread overview]
Message-ID: <20260731094534.8AB5C1F000E9@smtp.kernel.org> (raw)
In-Reply-To: <0fbb8d766b6ed33bf4ae9b066eac174f55ae5b56.1785480242.git.zhoubinbin@loongson.cn>
> The Loongson-2K0300 SoC exposes its chip ID registers through a syscon
> interface. Add the specific compatible `loongson,ls2k0300-chipid-syscon`
> to the allowed list of syscon bindings so that it can be referenced from
> the thermal node via a phandle.
>
> Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Sashiko has reviewed this patch and found no issues. It looks great!
--
Sashiko AI review · https://sashiko.dev/#/patchset/cover.1785480242.git.zhoubinbin@loongson.cn?part=3
next prev parent reply other threads:[~2026-07-31 9:45 UTC|newest]
Thread overview: 11+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-07-31 9:42 [PATCH v3 0/5] thermal: loongson2: Add support for Loongson-2K0300 SoC Binbin Zhou
2026-07-31 9:42 ` [PATCH v3 1/5] thermal/drivers/loongson2: Correct thermal sensor registration loop Binbin Zhou
2026-07-31 9:50 ` sashiko-bot
2026-07-31 9:42 ` [PATCH v3 2/5] thermal/drivers/loongson2: Move thermal_ops to chip_data for SoC scalability Binbin Zhou
2026-07-31 9:50 ` sashiko-bot
2026-07-31 9:42 ` [PATCH v3 3/5] dt-bindings: mfd: syscon: Allow syscon compatible for Loongson-2K0300 chip id Binbin Zhou
2026-07-31 9:45 ` sashiko-bot [this message]
2026-07-31 9:43 ` [PATCH v3 4/5] dt-bindings: thermal: loongson,ls2k-thermal: Add compatible for Loongson-2K0300 Binbin Zhou
2026-07-31 9:57 ` sashiko-bot
2026-07-31 9:43 ` [PATCH v3 5/5] thermal/drivers/loongson2: Add support " Binbin Zhou
2026-07-31 9:53 ` sashiko-bot
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