Re: [PATCH 2/2] arm64: dts: qcom: shikra: Enable CDSP & Modem cooling

[sashiko-bot@kernel.org]

Thank you for your contribution! Sashiko AI review found 2 potential issue(s) to consider:
- [Low] The patch introduces a fatal build failure by including a non-existent device tree bindings header file and referencing undefined macros for the QMI TMD cooling framework.
- [Low] The addition of the `#cooling-cells` property to the remoteproc nodes violates strict Device Tree schema bindings.
--

commit 4b1a1d4f27b1c457bd265f6d0f4a5b333e378019
Author: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>

arm64: dts: qcom: shikra: Enable CDSP & Modem cooling

This commit sets up CDSP and modem cooling by throttling them using the
QMI TMD cooling device framework when they reach high temperatures.

> diff --git a/arch/arm64/boot/dts/qcom/shikra.dtsi b/arch/arm64/boot/dts/qcom/shikra.dtsi
> index c1f06f692f664..55bac1b57cbac 100644
> --- a/arch/arm64/boot/dts/qcom/shikra.dtsi
> +++ b/arch/arm64/boot/dts/qcom/shikra.dtsi
> @@ -10,6 +10,7 @@
>  #include <dt-bindings/interconnect/qcom,icc.h>
>  #include <dt-bindings/interconnect/qcom,osm-l3.h>
>  #include <dt-bindings/dma/qcom-gpi.h>
> +#include <dt-bindings/thermal/qcom,pas.h>

[Severity: Low]
The header file <dt-bindings/thermal/qcom,pas.h> appears to be completely
missing from the tree.

Does this include cause a fatal build failure?

[ ... ]

> @@ -2007,6 +2008,8 @@ remoteproc_mpss: remoteproc@6080000 {
>  			qcom,smem-states = <&modem_smp2p_out 0>;
>  			qcom,smem-state-names = "stop";
>  
> +			#cooling-cells = <3>;

[Severity: Low]
The #cooling-cells property is not documented in the remoteproc schemas.
The qcom,shikra-pas.yaml and qcom,pas-common.yaml bindings specify
unevaluatedProperties: false.

Does adding this property cause make dtbs_check to fail with a schema
validation error?

[ ... ]

> @@ -2047,6 +2050,8 @@ remoteproc_cdsp: remoteproc@b300000 {
>  			qcom,smem-states = <&cdsp_smp2p_out 0>;
>  			qcom,smem-state-names = "stop";
>  
> +			#cooling-cells = <3>;

[Severity: Low]
This seems to add #cooling-cells to the remoteproc_cdsp node as well.

Does this also trigger the same strict DT schema validation failure?

[ ... ]

> @@ -3877,15 +3884,31 @@ trip-point0 {
>  					type = "hot";
>  				};
>  
> -				nsp-critical {
> +				nsp_alert1: nsp-alert1 {
>  					temperature = <115000>;
> +					hysteresis = <5000>;
> +					type = "passive";
> +				};
> +
> +				nsp-critical {
> +					temperature = <118000>;
>  					hysteresis = <0>;
>  					type = "critical";
>  				};
>  			};
> +
> +			cooling-maps {
> +				map0 {
> +					trip = <&nsp_alert1>;
> +					cooling-device = <&remoteproc_cdsp QCOM_TMD_CDSP_SW
> +							 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;

[Severity: Low]
The <dt-bindings/thermal/qcom,pas.h> header is missing, which leaves macros
like QCOM_TMD_CDSP_SW, QCOM_TMD_PA, and QCOM_TMD_MODEM undefined.

Will this line lead to a fatal device tree compiler error?

-- 
Sashiko AI review · https://sashiko.dev/#/patchset/20260911-shikra_qmi_tmd-v1-0-96c1cca82f30@oss.qualcomm.com?part=2