From: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
To: "Rafael J. Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@kernel.org>,
Zhang Rui <rui.zhang@intel.com>,
Lukasz Luba <lukasz.luba@arm.com>, Rob Herring <robh@kernel.org>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Conor Dooley <conor+dt@kernel.org>,
Jonathan Corbet <corbet@lwn.net>,
Shuah Khan <skhan@linuxfoundation.org>,
Randy Dunlap <rdunlap@infradead.org>,
Amit Kucheria <amitk@kernel.org>,
Thara Gopinath <thara.gopinath@gmail.com>,
Bjorn Andersson <andersson@kernel.org>,
Konrad Dybcio <konradybcio@kernel.org>,
Abel Vesa <abelvesa@kernel.org>
Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org,
linux-kernel@vger.kernel.org, linux-doc@vger.kernel.org,
linux-arm-msm@vger.kernel.org,
Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>,
Amit Kucheria <amit.kucheria@oss.qualcomm.com>
Subject: [PATCH 3/6] dt-bindings: thermal: qcom-tsens: document qcm6490 tsens
Date: Fri, 02 Oct 2026 16:16:58 +0530 [thread overview]
Message-ID: <20261002-thermal_bin-v1-3-5a29be7e8ec5@oss.qualcomm.com> (raw)
In-Reply-To: <20261002-thermal_bin-v1-0-5a29be7e8ec5@oss.qualcomm.com>
From: Amit Kucheria <amit.kucheria@oss.qualcomm.com>
QCM6490 uses a tsens-v2 IP block and supports hardware-binned critical
trip points. Add its compatible to the tsens-v2 enum.
SoCs that support hardware-bin critical trips read their manufacturing
bin from qfprom fuse cells rather than the usual calibration cells: a
single "i-temp" bit on hamoa/purwa-class parts, and a "jtag-id"/
"feat-id" pair on sc7280/qcm6490. Extend nvmem-cell-names with two
oneOf branches so these fuse-cell names validate.
Signed-off-by: Amit Kucheria <amit.kucheria@oss.qualcomm.com>
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
---
Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 8 ++++++++
1 file changed, 8 insertions(+)
diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index 5a8f7673e730..6899f07ec218 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -65,6 +65,7 @@ properties:
- qcom,msm8996-tsens
- qcom,msm8998-tsens
- qcom,qcm2290-tsens
+ - qcom,qcm6490-tsens
- qcom,qcs8300-tsens
- qcom,qcs615-tsens
- qcom,sa8255p-tsens
@@ -244,6 +245,13 @@ properties:
- pattern: '^tsens_sens[0-9]+_off$'
- pattern: '^tsens_sens[0-9]+_off$'
- pattern: '^tsens_sens[0-9]+_off$'
+ # hardware-binning fuse cells: a single i-temp bit
+ - items:
+ - const: i-temp
+ # hardware-binning fuse cells: jtag-id and feature-id
+ - items:
+ - const: jtag-id
+ - const: feat-id
"#qcom,sensors":
description:
--
2.34.1
next prev parent reply other threads:[~2026-10-02 10:47 UTC|newest]
Thread overview: 10+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-10-02 10:46 [PATCH 0/6] thermal: Add hardware-binned trip point support Gaurav Kohli
2026-10-02 10:46 ` [PATCH 1/6] dt-bindings: thermal: thermal-zones: add hardware-binning trip properties Gaurav Kohli
2026-10-02 10:55 ` sashiko-bot
2026-10-02 10:46 ` [PATCH 2/6] thermal: add hardware-binning trip-point filtering support Gaurav Kohli
2026-10-02 10:59 ` sashiko-bot
2026-10-02 10:46 ` Gaurav Kohli [this message]
2026-10-02 10:46 ` [PATCH 4/6] thermal: qcom: tsens: add hardware-bin trip-point filtering Gaurav Kohli
2026-10-02 10:57 ` sashiko-bot
2026-10-02 10:47 ` [PATCH 5/6] arm64: dts: qcom: kodiak: use thermal hw-bin trips Gaurav Kohli
2026-10-02 10:47 ` [PATCH 6/6] arm64: dts: qcom: hamoa: add thermal hw-bin support Gaurav Kohli
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