Re: [PATCH v6 1/9] dt-bindings: remoteproc: qcom,pas: add #cooling-cells property

[Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>]

On 7/31/2026 12:02 AM, Daniel Lezcano wrote:
> 
> Hi Gaurav,
> 
> 
> On 7/27/26 16:22, Gaurav Kohli wrote:
>> Document the optional #cooling-cells property for Qualcomm PAS
>> remoteproc nodes so they can be used as thermal cooling devices via
>> the QMI Thermal Mitigation Device (TMD) interface.
>>
>> Qualcomm remote processors expose TMD endpoints that support thermal
>> throttling through firmware. The cooling-device specifier uses 3 cells:
>>
>>    <&phandle device_id min_state max_state>
>>
>> where device_id selects the TMD endpoint (for example PA, modem, or
>> CDSP software mitigation), with constants defined in:
>> include/dt-bindings/thermal/qcom,pas.h
>>
>> Example usage in a thermal zone:
>>
>>    cooling-maps {
>>        map0 {
>>            trip = <&cpu_alert>;
>>            cooling-device = <&remoteproc_cdsp
>>                             QCOM_TMD_CDSP_SW
>>                             0 THERMAL_NO_LIMIT>;
>>        };
>>    };
>>
>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>> ---
>>   .../bindings/remoteproc/qcom,pas-common.yaml         |  9 +++++++++
>>   MAINTAINERS                                          |  1 +
>>   include/dt-bindings/thermal/qcom,pas.h               | 20 ++++++++++ 
>> ++++++++++
>>   3 files changed, 30 insertions(+)
>>
>> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas- 
>> common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas- 
>> common.yaml
>> index 11faf655f530..f75cab6b4ed9 100644
>> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> @@ -77,6 +77,15 @@ properties:
>>         channels and devices related to the ADSP.
>>       unevaluatedProperties: false
>> +  '#cooling-cells':
>> +    description: |
>> +      Cooling device with three cells:
>> +        Cell 0: Cooling device id as defined in
>> +                include/dt-bindings/thermal/qcom,pas.h
>> +        Cell 1: Minimum cooling state
>> +        Cell 2: Maximum cooling state
>> +    const: 3
> 
> I'm not sure it is necessary to re-explain what is the property format 
> as it is already described in thermal-cooling-devices.yaml

thanks Daniel for review.
Krzysztof suggested to add path here also for better explanation.
> 
> Other than that:
> 
> Acked-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
> 
>>     glink-edge:
>>       $ref: /schemas/remoteproc/qcom,glink-edge.yaml#
>>       description:
>> diff --git a/MAINTAINERS b/MAINTAINERS
>> index dcffe9fc54f6..3f1e2bbf7099 100644
>> --- a/MAINTAINERS
>> +++ b/MAINTAINERS
>> @@ -3423,6 +3423,7 @@ F:    drivers/watchdog/gunyah_wdt.c
>>   F:    include/dt-bindings/arm/qcom,ids.h
>>   F:    include/dt-bindings/firmware/qcom,scm.h
>>   F:    include/dt-bindings/soc/qcom*
>> +F:    include/dt-bindings/thermal/qcom,pas.h
>>   F:    include/linux/firmware/qcom
>>   F:    include/linux/soc/qcom/
>>   F:    include/soc/qcom/
>> diff --git a/include/dt-bindings/thermal/qcom,pas.h b/include/dt- 
>> bindings/thermal/qcom,pas.h
>> new file mode 100644
>> index 000000000000..f603bddef9a8
>> --- /dev/null
>> +++ b/include/dt-bindings/thermal/qcom,pas.h
>> @@ -0,0 +1,20 @@
>> +/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */
>> +/*
>> + * Qualcomm PAS remoteproc cooling device indices
>> + *
>> + * These indices are used in device tree cooling-maps to reference
>> + * specific TMD devices provided by PAS-managed remote processors via 
>> QMI.
>> + *
>> + * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries.
>> + */
>> +#ifndef _DT_BINDINGS_THERMAL_QCOM_PAS_H
>> +#define _DT_BINDINGS_THERMAL_QCOM_PAS_H
>> +
>> +/* CDSP thermal mitigation device id */
>> +#define QCOM_TMD_CDSP_SW    0
>> +
>> +/* Modem thermal mitigation device id */
>> +#define QCOM_TMD_PA    0
>> +#define QCOM_TMD_MODEM    1
>> +
>> +#endif /* _DT_BINDINGS_THERMAL_QCOM_PAS_H */
>>
>