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From:   Heiko =?ISO-8859-1?Q?St=FCbner?= <heiko@sntech.de>
To:     "Rafael J. Wysocki" <rafael@kernel.org>,
        Daniel Lezcano <daniel.lezcano@linaro.org>,
        Amit Kucheria <amitk@kernel.org>,
        Zhang Rui <rui.zhang@intel.com>,
        Sebastian Reichel <sebastian.reichel@collabora.com>
Cc:     Rob Herring <robh+dt@kernel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
        linux-pm@vger.kernel.org, linux-rockchip@lists.infradead.org,
        devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
        Sebastian Reichel <sebastian.reichel@collabora.com>,
        kernel@collabora.com
Subject: Re: [PATCH 2/2] dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible
Date:   Fri, 21 Oct 2022 21:13:02 +0200
Message-ID: <3197889.aeNJFYEL58@diego>
In-Reply-To: <20221021174721.92468-3-sebastian.reichel@collabora.com>
References: <20221021174721.92468-1-sebastian.reichel@collabora.com> <20221021174721.92468-3-sebastian.reichel@collabora.com>
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Am Freitag, 21. Oktober 2022, 19:47:21 CEST schrieb Sebastian Reichel:
> Add a new compatible for the thermal sensor device on RK3588 SoCs.
> 
> Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>

Reviewed-by: Heiko Stuebner <heiko@sntech.de>