Re: [PATCH v2] dt-bindings: thermal: idle: Complete the example code

[Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>]

On 20/04/2026 20:06, Daniel Lezcano wrote:
> On 4/7/26 21:29, Rob Herring (Arm) wrote:
>>
>> On Tue, 07 Apr 2026 07:39:58 +0200, Krzysztof Kozlowski wrote:
>>> Thermal bindings expect the node name with all the zones to be named
>>> 'thermal-zones' (hyphen instead of underscore) and thermal zones to end
>>> with '-thermal'.  Also DTS coding style is not to use underscores for
>>> node names.  After using correct names, bindings point warnings for
>>> missing properties, so add also thermal-sensors.  Drop fake top
>>> compatible as it is not useful in this context.
>>>
>>> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
>>>
>>> ---
>>>
>>> Changes in v2:
>>> 1. Drop top level compatible and other properties
>>> 2. Add thermal-sensors
>>> 3. Rename also trips and cpu-thermal
>>> ---
>>>   .../bindings/thermal/thermal-idle.yaml         | 18 +++++++-----------
>>>   1 file changed, 7 insertions(+), 11 deletions(-)
>>>
>>
>> My bot found errors running 'make dt_binding_check' on your patch:
> 
> Hi Krzysztof,
> 
> what about this error ?

It's real and it answers why fake model and compatible properties were
there in the first place. Please drop the patch from your queue, I will
prepare v3 at some point but needs a bit more time.

Best regards,
Krzysztof