Re: [PATCH v1 14/14] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

On 4/22/26 09:31, Krzysztof Kozlowski wrote:
> On Sun, Apr 19, 2026 at 08:21:58PM +0200, Daniel Lezcano wrote:
>> diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>> index b9022f1613d8..28f5818f1e60 100644
>> --- a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>> +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>> @@ -44,10 +44,14 @@ select: true
>>   properties:
>>     "#cooling-cells":
>>       description:
>> -      Must be 2, in order to specify minimum and maximum cooling state used in
>> +      Must be 2 or 3. If 2, specifies minimum and maximum cooling state used in
>>         the cooling-maps reference. The first cell is the minimum cooling state
>>         and the second cell is the maximum cooling state requested.
>> -    const: 2
>> +      If 3, the first cell specifies the thermal mitigation device specifier
>> +      index for devices that support multiple thermal mitigation mechanisms.
>> +      The two other cells are respectively the minimum cooling state and the
>> +      maximum cooling state.
>> +    enum: [2, 3]
> 
> In the same commit you need to narrow
> Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
> so it will keep value of '2' (const: 2, like all other bindings).

Ah yes, thanks !