From mboxrd@z Thu Jan 1 00:00:00 1970 From: kongxinwei Subject: Re: [PATCH 0/3] 96boards: add thermal senor support to hikey board Date: Fri, 20 Mar 2015 15:41:37 +0800 Message-ID: <550BCF31.2000009@hisilicon.com> References: <1426751849-10604-1-git-send-email-kong.kongxinwei@hisilicon.com> <20150319135946.GG18473@leverpostej> <550B8F98.3070701@hisilicon.com> <20150320061322.GD18907@leoy-linaro> Mime-Version: 1.0 Content-Type: text/plain; charset=utf-8 Content-Transfer-Encoding: QUOTED-PRINTABLE Return-path: In-Reply-To: <20150320061322.GD18907@leoy-linaro> Sender: linux-kernel-owner@vger.kernel.org To: Leo Yan Cc: Mark Rutland , "devicetree@vger.kernel.org" , "linux-pm@vger.kernel.org" , "linuxarm@huawei.com" , "xuwei5@hisilicon.com" , "linux-kernel@vger.kernel.org" , "edubezval@gmail.com" , jorge.ramirez-ortiz@linaro.org, "rui.zhuang@intel.com" , "liguozhu@hisilicon.com" , "linux-arm-kernel@lists.infradead.org" List-Id: devicetree@vger.kernel.org =E5=9C=A8 2015/3/20 14:13, Leo Yan =E5=86=99=E9=81=93: > On Fri, Mar 20, 2015 at 11:10:16AM +0800, kongxinwei wrote: >> hi Mark Rutland: >> >> =E5=9C=A8 2015/3/19 21:59, Mark Rutland =E5=86=99=E9=81=93: >>> On Thu, Mar 19, 2015 at 07:57:26AM +0000, kongxinwei wrote: >>>> The Linaro connect introduce 96boards series in Hong Kong,The HiKe= y board >>>> is the first board to be certified 96Boards Consumer Edition compa= tible. >>>> This board is based on the HiSilicon SoC. you can get more informa= tion >>>> from https://www.96boards.org. >>>> >>>> The hisilicon SoC contains thermal module, this thermal module has= 4 sensors, >>>> >>>> - sensor 0: local sensor; >>>> - sensor 1: remote sensor for ACPU cluster 1; >>>> - sensor 2: remote sensor for ACPU cluster 2; >>>> - sensor 3: remote sensor for GPU; >>>> >>>> It can obtain this device temperature by operating this hardware. = The new >>>> sensor driver satisfies thermal framework and to realize the ACPU = ,GPU and >>>> so on to cool function. >>>> >>>> kongxinwei (3): >>>> thermal: hisilicon: add new hisilicon thermal sensor driver >>>> dts: hi6220: enable thermal sensor for hisilicon SoC >>>> dt-bindings: Document the hi6220 thermal sensor bindings >>>> >>>> .../bindings/thermal/hisilicon-thermal.txt | 51 ++ >>>> arch/arm64/boot/dts/hisilicon/hi6220.dtsi | 153 ++++++ >>>> drivers/thermal/Kconfig | 8 + >>>> drivers/thermal/Makefile | 1 + >>>> drivers/thermal/hisi_thermal.c | 531 ++++++++= +++++++++++++ >>> >>> Mainline does not have a hi6220 dtsi. >>> >>> Which tree is this against? >>> >>> What are your dependencies? >>> >>> Mark. >>> >> Hikey board code are being upstreamed by our team.If hi6220 dtsi be = accepted, this patch is ok. >=20 > Xinwei, u could resend this patch after hi6220 dtsi related patches h= as > been merged. Suggest this patchset are only for thermal driver. >=20 > Thanks, > Leo Yan >=20 Oh,i wish that many persons review it and give some comments, then i wi= ll send v2 patch and reduce dts file. Thanks, Xin Wei > . >=20