From mboxrd@z Thu Jan 1 00:00:00 1970 From: Xinwei Kong Subject: Re: [PATCH RESEND v4 0/2] 96boards: add thermal senor support to hikey board Date: Tue, 12 May 2015 11:12:39 +0800 Message-ID: <55516FA7.3040808@hisilicon.com> References: <1430707940-14468-1-git-send-email-kong.kongxinwei@hisilicon.com> <20150512013107.GE4810@localhost.localdomain> Mime-Version: 1.0 Content-Type: text/plain; charset="windows-1252" Content-Transfer-Encoding: 7bit Return-path: In-Reply-To: <20150512013107.GE4810@localhost.localdomain> Sender: linux-pm-owner@vger.kernel.org To: Eduardo Valentin Cc: rui.zhuang@intel.com, amit.kucheria@linaro.org, punit.agrawal@arm.com, Javi.Merino@arm.com, jorge.ramirez-ortiz@linaro.org, haojian.zhuang@linaro.org, linux-pm@vger.kernel.org, linuxarm@huawei.com, devicetree@vger.kernel.org, dan.zhao@hisilicon.com, liguozhu@hisilicon.com, mporter@konsulko.com, gongyu@hisilicon.com, guodong.xu@linaro.org, robh@kernel.org, leo.yan@linaro.org, zhenwei.wang@hisilicon.com, zhangfei.gao@linaro.org, z.liuxinliang@huawei.com, xuwei5@hisilicon.com, w.f@huawei.com, yuanzhichang@hisilicon.com, mark.rutland@arm.comLeo Yan List-Id: devicetree@vger.kernel.org On 2015/5/12 9:31, Eduardo Valentin wrote: > On Mon, May 04, 2015 at 10:52:18AM +0800, Xinwei Kong wrote: >> From: kongxinwei >> >> The Linaro connect introduce 96boards series in Hong Kong,The HiKey board >> is the first board to be certified 96Boards Consumer Edition compatible. >> This board is based on the HiSilicon SoC. you can get more information >> from https://www.96boards.org. >> >> The hisilicon SoC contains thermal module, this thermal module has 4 sensors, >> >> - sensor 0: local sensor; >> - sensor 1: remote sensor for ACPU cluster 1; >> - sensor 2: remote sensor for ACPU cluster 2; >> - sensor 3: remote sensor for GPU; >> >> It can obtain this device temperature by operating this hardware. The new >> sensor driver satisfies thermal framework and to realize the ACPU ,GPU and >> so on to cool function. >> >> Changes v0->v1; >> * Delete this hi6220 dtsi. >> * Fix documentation and error checks. >> * Modify this driver which makes use of kernel to decide how to dynamically >> bind the interrupt to hottest sensor. >> * Delete "sensor-thres-temp" property and read thermal_zone trips points >> replace of it. >> * Delete "sensor-reset-temp" property and define the fixed value replace >> of it. >> >> Changes v1->v2; >> * change patch's position between binding document and driver file >> * clean up some regiser for enabling thermal sensor >> * use mutex lock to replace the spin lock >> >> Changes v2->v3; >> * delete sensor id property in binding document >> * fix sensor driver to satisfy sensor register after deleting sensor id >> property >> >> Changes v3->v4; >> * using "usleep_range" function instead of "msleep" function >> * delete code detail error >> >> kongxinwei (2): >> dt-bindings: Document the hi6220 thermal sensor bindings >> thermal: hisilicon: add new hisilicon thermal sensor driver >> >> .../bindings/thermal/hisilicon-thermal.txt | 23 ++ >> drivers/thermal/Kconfig | 8 + >> drivers/thermal/Makefile | 1 + >> drivers/thermal/hisi_thermal.c | 437 +++++++++++++++++++++ > > Can you please include a patch adding the DT bindings for a board in you > next version? Even if the patches don't go in one single tree, it is > good to review all patches (DT and drivers) in one single patch series. > Ok, accept it. >> 4 files changed, 469 insertions(+) >> create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt >> create mode 100644 drivers/thermal/hisi_thermal.c >> >> -- >> 1.9.1 >> >>