From mboxrd@z Thu Jan  1 00:00:00 1970
From: Laxman Dewangan <ldewangan@nvidia.com>
Subject: Re: [PATCH V3 1/2] thermal: max77620: Add DT binding doc for thermal
 driver
Date: Tue, 7 Jun 2016 12:08:23 +0530
Message-ID: <57566BDF.3090100@nvidia.com>
References: <1465213467-23518-1-git-send-email-ldewangan@nvidia.com> <575645B8.5090709@ti.com>
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To: Keerthy <a0393675@ti.com>, edubezval@gmail.com, rui.zhang@intel.com, robh+dt@kernel.org
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On Tuesday 07 June 2016 09:25 AM, Keerthy wrote:
>
>
> On Monday 06 June 2016 05:14 PM, Laxman Dewangan wrote:
>> Maxim Semiconductor MAX77620 supports alarm interrupts when
>> its die temperature crosses 120C and 140C. These threshold
>> temperatures are not configurable.
>>
>> Add DT binding document to details out the DT property related
>> to MAX77620 thermal functionality.
>>
>> Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
>> ---
>>   .../bindings/thermal/thermal-max77620.txt          | 64 
>> ++++++++++++++++++++++
>>   1 file changed, 64 insertions(+)
>>   create mode 100644 
>> Documentation/devicetree/bindings/thermal/thermal-max77620.txt
>>
>> diff --git 
>> a/Documentation/devicetree/bindings/thermal/thermal-max77620.txt 
>> b/Documentation/devicetree/bindings/thermal/thermal-max77620.txt
>> new file mode 100644
>> index 0000000..5a500d5
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/thermal-max77620.txt
>> @@ -0,0 +1,64 @@
>> +Thermal driver for MAX77620 Power management IC from Maxim 
>> Semiconductor.
>> +
>> +Maxim Semiconductor MAX77620 supports alarm interrupts when its
>> +die temperature crosses 120C and 140C. These threshold temperatures
>> +are not configurable. Device does not provide the real temperature
>> +of die other than just indicating whether temperature is above or
>> +below threshold level.
>> +
>> +Required properties:
>> +-------------------
>> +#thermal-sensor-cells:    Please refer 
>> <devicetree/bindings/thermal/thermal.txt>
>> +            for more details.
>> +            The value must be 0.
>> +
>> +For more details, please refer generic thermal DT binding document
>> +<devicetree/bindings/thermal/thermal.txt>.
>> +
>> +Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding
>> +document for the MAX77620.
>> +
>> +Example:
>> +--------
>> +#include <dt-bindings/mfd/max77620.h>
>> +#include <dt-bindings/thermal/thermal.h>
>> +...
>> +
>> +i2c@7000d000 {
>> +    spmic: max77620@3c {
>> +        compatible = "maxim,max77620";
>> +        :::::
>> +        #thermal-sensor-cells = <0>;
>> +        :::
>> +    };
>> +};
>> +
>> +cool_dev: cool-dev {
>> +    compatible = "cooling-dev";
>> +    #cooling-cells = <2>;
>> +};
>> +
>> +thermal-zones {
>> +    PMIC-Die {
>> +        polling-delay = <0>;
>> +        polling-delay-passive = <0>;
>> +        thermal-sensors = <&spmic>;
>> +
>> +        trips {
>> +            die_temp_thresh: hot-die {
>> +                temperature = <120000>;
>> +                type = "active";
>> +                hysteresis = <0>;
>> +            };
>> +        };
>
> What about 140C? Isn't that a critical trip point?

Yes, it is there and it can be populated/extended on the same way and 
handled.

This is just an example.


>
>> +
>> +        cooling-maps {
>> +            map0 {
>> +                trip = <&die_temp_thresh>;
>> +                cooling-device = <&cool_dev THERMAL_NO_LIMIT
>> +                          THERMAL_NO_LIMIT>;
>> +                contribution = <100>;
>> +            };
>> +        };
>> +    };
>> +};
>>