Re: [PATCH 0/2] dt: thermal: Fix broken cooling-maps

[Wei Xu <xuwei5@hisilicon.com>]

Hi Viresh,

On 2018/7/19 3:40, Viresh Kumar wrote:
> On 18-07-18, 16:34, Wei Xu wrote:
>> Hi Viresh,
>>
>> On 2018/7/5 6:09, Viresh Kumar wrote:
>>> Hi,
>>>
>>> This is an attempt to fix the broken or partially defined DT bindings
>>> for cooling-maps. We should list every device that participates in
>>> cooling down at a certain trip point, instead of just the first in the
>>> list as that depends on certain ordering of events to work properly.
>>>
>>> The first patch extends the binding to allow a list of phandles in
>>> "cooling-device" property and the second patch fixes one of the
>>> platform's DT.
>>>
>>> This will be followed up by fixing all platform DT bindings that have
>>> these issues after this set is accepted.
>>>
>>> The kernel also requires some changes to handle the phandle list, but
>>> wouldn't break with these changes as it reads the first phandle in the
>>> list for now. We can update that separately.
>>>
>>> --
>>> viresh
>>>
>>> Viresh Kumar (2):
>>>   dt-bindings: thermal: Allow multiple devices to share cooling map
>>>   arm64: dts: hi6220: Add all CPUs in cooling maps
>>>
>>>  Documentation/devicetree/bindings/thermal/thermal.txt | 11 +++--------
>>>  arch/arm64/boot/dts/hisilicon/hi6220.dtsi             |  9 ++++++++-
>>>  2 files changed, 11 insertions(+), 9 deletions(-)
>>>
>>
>> Thanks!
>> Applied both to the hisilicon dt tree.
> 
> Hi Wei,
> 
> I expected the first patch to go via the thermal tree as it is for the
> thermal core maintainers. Second patch can very well go from your
> tree, but only after the 1st one is applied by thermal maintainers.
> 

OK. I will drop them in the pull request and apply the dts patch later.

Best Regards,
Wei