From: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
To: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>,
Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>,
Krzysztof Kozlowski <krzk@kernel.org>
Cc: andersson@kernel.org, mathieu.poirier@linaro.org,
robh@kernel.org, krzk+dt@kernel.org, conor+dt@kernel.org,
rui.zhang@intel.com, lukasz.luba@arm.com, konradybcio@kernel.org,
mani@kernel.org, casey.connolly@linaro.org,
amit.kucheria@oss.qualcomm.com, linux-arm-msm@vger.kernel.org,
devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
linux-pm@vger.kernel.org, manaf.pallikunhi@oss.qualcomm.com
Subject: Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
Date: Mon, 23 Mar 2026 13:29:14 +0100 [thread overview]
Message-ID: <7e50100a-514f-4f73-a976-9858ce5cc0e1@oss.qualcomm.com> (raw)
In-Reply-To: <909009ab-53fe-4b20-ad2c-bc8eac9e8bc1@oss.qualcomm.com>
On 3/21/26 10:00 AM, Daniel Lezcano wrote:
>
> Hi Konrad,
>
> On 3/19/26 10:51, Konrad Dybcio wrote:
>> On 3/18/26 11:17 AM, Gaurav Kohli wrote:
>>>
>>>
>>> On 3/17/2026 1:27 AM, Daniel Lezcano wrote:
>>>> On Tue, Feb 24, 2026 at 01:17:22PM +0100, Krzysztof Kozlowski wrote:
>>>>> On 24/02/2026 13:09, Gaurav Kohli wrote:
>>>>
>>>> [ ... ]
>>>>
>>>>>>>> As a result, each core requires its own cooling device, which must be
>>>>>>>> linked to its TSENS thermal zone. Because of this, we introduced
>>>>>>>> multiple child nodes—one for each cooling device.
>>>>>>>
>>>>>>> So you have one device with cooling cells=1+2, no?
>>>>>>>
>>>>>>
>>>>>> This will be a bigger framework change which is not supported, i can see
>>>>>
>>>>> I don't think that changing open source frameworks is "not supported". I
>>>>> am pretty sure that changing is not only supported, but actually desired.
>>>>
>>>> Yes, IMO it could make sense. There are the thermal zones with phandle
>>>> to a sensor and a sensor id. We can have the same with a phandle to a
>>>> cooling device and a cooling device id.
>>>>
>>>> (... or several ids because the thermal sensor can also have multiple
>>>> ids ?)
>>>>
>>>> May be an array of names corresponding to the TMD names at the 'id'
>>>> position ?
>>>>
>>>
>>> I am using dt node like below to use with cooling-cells = <3> approach, will post new patches with that.
>>>
>>> cdsp_tmd: cdsp-tmd {
>>> compatible = "qcom,qmi-cooling-cdsp";
>>> tmd-names = "cdsp_sw", "cdsp_hw";
>>> #cooling-cells = <3>;
>>> };
>>>
>>> please let me know, if you are expecting something like this only.
>>
>> My question about the need of a separate node still remains, i.e.
>> why can't this be:
>>
>> remoteproc_cdsp: remoteproc@cafebabe {
>> compatible = "qcom,foo-cdsp"
>>
>> ...
>>
>> tmd-names = "abc", "xyz";
>> #cooling-cells = <3>;
>> };
>>
>>
>>
>> foo-thermal {
>> cooling-maps {
>> map0 {
>> cooling-device = <&remoteproc_cdsp CDSP_COOLING_XYZ
>> THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
>> };
>> };
>> };
>>
>> where you'd presumably call something like qmi_cooling_register(...) from
>> the remoteproc driver, making your added code essentially a library, not a
>> separate platform device
>
> I'm not sure to get your question. My understanding of the 3 cooling-cells is exactly what you described. The second argument of the cooling-device map is an index corresponding to the id of the TMD. BTW I prefer also the compatible name like 'qcom,foo-cdsp'
My specific suggestion is to _not_ spawn an additional node, since all
of this logic relates to the behavior of the (e.g.) CDSP, which already
has its own node
Konrad
next prev parent reply other threads:[~2026-03-23 12:29 UTC|newest]
Thread overview: 53+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-01-27 15:57 [PATCH v2 0/8] Add RemoteProc cooling support Gaurav Kohli
2026-01-27 15:57 ` [PATCH v2 1/8] thermal: Add Remote Proc cooling driver Gaurav Kohli
2026-01-28 11:32 ` Krzysztof Kozlowski
2026-01-30 6:39 ` Gaurav Kohli
2026-02-08 10:08 ` Krzysztof Kozlowski
2026-01-28 11:36 ` Krzysztof Kozlowski
2026-01-30 6:42 ` Gaurav Kohli
2026-01-30 5:39 ` kernel test robot
2026-01-30 6:47 ` kernel test robot
2026-03-06 9:19 ` Daniel Lezcano
2026-03-06 9:27 ` Lukasz Luba
2026-03-09 6:34 ` Gaurav Kohli
2026-01-27 15:57 ` [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings Gaurav Kohli
2026-01-28 11:27 ` Krzysztof Kozlowski
2026-01-29 12:06 ` Gaurav Kohli
2026-02-08 10:06 ` Krzysztof Kozlowski
2026-02-11 7:37 ` Gaurav Kohli
2026-02-11 8:13 ` Krzysztof Kozlowski
2026-02-20 7:29 ` Gaurav Kohli
2026-02-20 7:44 ` Krzysztof Kozlowski
2026-02-24 12:09 ` Gaurav Kohli
2026-02-24 12:17 ` Krzysztof Kozlowski
2026-03-16 19:57 ` Daniel Lezcano
2026-03-18 10:17 ` Gaurav Kohli
2026-03-19 9:51 ` Konrad Dybcio
2026-03-21 9:00 ` Daniel Lezcano
2026-03-23 12:29 ` Konrad Dybcio [this message]
2026-03-23 14:19 ` Daniel Lezcano
2026-03-23 14:25 ` Gaurav Kohli
2026-02-24 12:52 ` Dmitry Baryshkov
2026-01-28 11:28 ` Krzysztof Kozlowski
2026-01-29 12:12 ` Gaurav Kohli
2026-01-29 0:45 ` Dmitry Baryshkov
2026-01-30 7:08 ` Gaurav Kohli
2026-01-30 9:02 ` Dmitry Baryshkov
2026-01-27 15:57 ` [PATCH v2 3/8] remoteproc: qcom: probe all child devices Gaurav Kohli
2026-01-27 16:50 ` Dmitry Baryshkov
2026-01-27 15:57 ` [PATCH v2 4/8] thermal: qcom: add qmi-cooling driver Gaurav Kohli
2026-01-30 9:05 ` kernel test robot
2026-03-06 9:31 ` Daniel Lezcano
2026-03-16 10:19 ` Gaurav Kohli
2026-03-13 14:15 ` Daniel Lezcano
2026-03-17 7:25 ` Gaurav Kohli
2026-01-27 15:57 ` [PATCH v2 5/8] arm64: dts: qcom: lemans: Enable CDSP cooling Gaurav Kohli
2026-01-29 0:43 ` Dmitry Baryshkov
2026-01-29 12:10 ` Gaurav Kohli
2026-01-29 12:29 ` Dmitry Baryshkov
2026-01-29 13:40 ` Gaurav Kohli
2026-01-30 1:20 ` Dmitry Baryshkov
2026-01-27 15:57 ` [PATCH v2 6/8] arm64: dts: qcom: talos: " Gaurav Kohli
2026-01-27 15:57 ` [PATCH v2 7/8] arm64: dts: qcom: kodiak: " Gaurav Kohli
2026-01-27 15:57 ` [PATCH v2 8/8] arm64: dts: qcom: monaco: " Gaurav Kohli
2026-03-06 9:09 ` [PATCH v2 0/8] Add RemoteProc cooling support Daniel Lezcano
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