From mboxrd@z Thu Jan 1 00:00:00 1970 From: Punit Agrawal Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model Date: Mon, 02 Nov 2015 15:53:33 +0000 Message-ID: <9hh4mh4bdoi.fsf@e105922-lin.cambridge.arm.com> References: <1445515359-8587-1-git-send-email-dawei.chien@mediatek.com> <20151028154449.GH3716@ubuntu> Mime-Version: 1.0 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: 7bit Return-path: In-Reply-To: <20151028154449.GH3716@ubuntu> (Viresh Kumar's message of "Wed, 28 Oct 2015 21:14:49 +0530") List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , Sender: "Linux-mediatek" Errors-To: linux-mediatek-bounces+glpam-linux-mediatek=m.gmane.org-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org To: Viresh Kumar Cc: Mark Rutland , devicetree-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, srv_heupstream-NuS5LvNUpcJWk0Htik3J/w@public.gmane.org, Pawel Moll , Ian Campbell , Dawei Chien , Sascha Hauer , Daniel Lezcano , "Rafael J. Wysocki" , linux-kernel-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, Rob Herring , linux-pm-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, Sascha Hauer , Kumar Gala , Matthias Brugger , linux-mediatek-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org, linux-arm-kernel-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org List-Id: devicetree@vger.kernel.org Viresh Kumar writes: > On 22-10-15, 20:02, Dawei Chien wrote: >> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone. >> The power allocator governor allocates power budget to control CPU temperature. >> >> Power Allocator governor is able to keep SOC temperature within a >> defined temperature range to avoid SOC overheat and keep it's >> performance. mt8173-cpufreq.c need to register its' own power model >> with power allocator thermal governor, so that power allocator >> governor can allocates suitable power budget to control CPU >> temperature. >> >> PATCH1 is base on >> https://patchwork.kernel.org/patch/7034601/ >> >> PATCH2 is base on Sascha's thermal driver V9 >> https://patchwork.kernel.org/patch/7249821/ >> https://patchwork.kernel.org/patch/7249861/ >> https://patchwork.kernel.org/patch/7249891/ >> >> Change since V1: >> include mt8171.h and sort header file for mt8173.dtsi >> >> Change since V2: >> Move dynamic/static power model in device tree >> >> Dawei.Chien (2): >> thermal: mediatek: Add cpu power cooling model. >> arm64: dts: mt8173: Add thermal zone node for mt8173. > > Sorry for being extremely late in reviewing this stuff. You are > already on v3 and I haven't reviewed it once. Mostly due to bad timing > of my holidays and other work pressure. > > Now, there are few things that I feel are not properly addressed here, > and I may be wrong: > - Where are the bindings for static-power-points and > dynamic-power-coefficient. Sorry I failed to see them in this or > other series you mentioned. For dynamic power, I had posted some patches[0][1][2] introducing the binding as well as updating cooling device registration via cpufreq driver. Now that the SCPI hwmon driver is merged, I should re-send the remaining patches. [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html > - Even then, why should we be adding another table into DT for > voltage/power ? And not reuse and extend the opp-v2 stuff which is > already mainlined now. > - There are few issues with the code as well, but I want to see where > the bindings should go first. And then only discuss the code > further.