[PATCH v3 03/10] dt-bindings: vendor-prefixes: add eswin

Pinkesh Vaghela
2025-04-10T15:26:33Z

From: Pritesh Patel <pritesh.patel@einfochips.com>

Add new vendor string to dt bindings.
This new vendor string is used by
- ESWIN EIC770X SoC
- HiFive Premier P550 board which uses EIC7700 SoC.

Link: https://www.eswin.com/en/
Signed-off-by: Pritesh Patel <pritesh.patel@einfochips.com>
Reviewed-by: Samuel Holland <samuel.holland@sifive.com>
Signed-off-by: Pinkesh Vaghela <pinkesh.vaghela@einfochips.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
---
Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++
1 file changed, 2 insertions(+)

diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml
index 411fd65e0bde..ce881d9c96a4 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.yaml
+++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml
@@ -494,6 +494,8 @@ patternProperties:
description: Espressif Systems Co. Ltd.
"^est,.*":
description: ESTeem Wireless Modems
+ "^eswin,.*":
+ description: Beijing ESWIN Technology Group Co. Ltd.
"^ettus,.*":
description: NI Ettus Research
"^eukrea,.*":
--
2.25.1