Re: [PATCH v2 0/8] Add RemoteProc cooling support

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

Hi Gaurav,

On Tue, Jan 27, 2026 at 09:27:14PM +0530, Gaurav Kohli wrote:
> This series introduces a generic remote proc cooling framework to control 
> thermal sensors located on remote subsystem like modem, dsp etc.
> Communications with these subsystems occurs through various channels, for example, 
> QMI interface for Qualcomm.

Can you clarify the semantic of the driver ? It is described as
controlling the thermal sensors, except I'm missing something my
understanding it controls the level of performance of a subsystem
where a thermal sensor is tied to.

> The Framework provides an abstraction layer between thermal subsytem and vendor
> specific remote subsystem. Vendor drivers are expected to implement callback 
> and registration mechanisms with cooling framework to control cooling
> devices.
>
> This patchset also revives earlier discussions of QMI based TMD cooling
> devices discussion posted on below series by Casey: 
> https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org/
> 
> That series introduced Qualcomm QMI-based TMD cooling devices which used
> to mitigate thermal conditions across multiple remote subsystems. These 
> devices operate based on junction temperature sensors (TSENS) associated 
> with thermal zones for each subsystem and registering with remoteproc 
> cooling framework for cooling registration.
> ---
> Changes in v2:
> - Update Remoreproc thermal config to tristate and removed unnecessary NULL checks.
> - Fixed dt binding file format and added generic name support for cdsp.
> - Fixed memory leak and cleaned up qmi-cooling driver file.
> - Corrected DT formatting errors and commit descriptions for all targets.
> - Link to v1: https://lore.kernel.org/linux-devicetree/20251223123227.1317244-1-gaurav.kohli@oss.qualcomm.com/
> ---
> 
> Casey Connolly (2):
>   remoteproc: qcom: probe all child devices
>   thermal: qcom: add qmi-cooling driver
> 
> Gaurav Kohli (6):
>   thermal: Add Remote Proc cooling driver
>   dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
>   arm64: dts: qcom: lemans: Enable CDSP cooling
>   arm64: dts: qcom: talos: Enable CDSP cooling
>   arm64: dts: qcom: kodiak: Enable CDSP cooling
>   arm64: dts: qcom: monaco: Enable CDSP cooling
> 
>  .../bindings/remoteproc/qcom,pas-common.yaml  |   6 +
>  .../bindings/thermal/qcom,qmi-cooling.yaml    |  72 +++
>  MAINTAINERS                                   |   7 +
>  arch/arm64/boot/dts/qcom/kodiak.dtsi          |  37 ++
>  arch/arm64/boot/dts/qcom/lemans.dtsi          | 138 ++++-
>  arch/arm64/boot/dts/qcom/monaco.dtsi          |  93 ++++
>  arch/arm64/boot/dts/qcom/talos.dtsi           |  24 +
>  drivers/remoteproc/qcom_q6v5.c                |   4 +
>  drivers/remoteproc/qcom_q6v5_mss.c            |   8 -
>  drivers/soc/qcom/Kconfig                      |  13 +
>  drivers/soc/qcom/Makefile                     |   1 +
>  drivers/soc/qcom/qmi-cooling.c                | 510 ++++++++++++++++++
>  drivers/soc/qcom/qmi-cooling.h                | 429 +++++++++++++++
>  drivers/thermal/Kconfig                       |  10 +
>  drivers/thermal/Makefile                      |   2 +
>  drivers/thermal/remoteproc_cooling.c          | 143 +++++
>  include/linux/remoteproc_cooling.h            |  52 ++
>  17 files changed, 1529 insertions(+), 20 deletions(-)
>  create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>  create mode 100644 drivers/soc/qcom/qmi-cooling.c
>  create mode 100644 drivers/soc/qcom/qmi-cooling.h
>  create mode 100644 drivers/thermal/remoteproc_cooling.c
>  create mode 100644 include/linux/remoteproc_cooling.h
> 
> -- 
> 2.34.1
> 

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