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* [PATCH v4 0/6] thermal: qcom: tsens: Fix MDM9607, add MSM8909
@ 2023-05-08 13:13 Stephan Gerhold
  2023-05-08 13:13 ` [PATCH v4 1/6] thermal: qcom: tsens: Drop unused legacy structs Stephan Gerhold
                   ` (5 more replies)
  0 siblings, 6 replies; 10+ messages in thread
From: Stephan Gerhold @ 2023-05-08 13:13 UTC (permalink / raw)
  To: Daniel Lezcano
  Cc: Amit Kucheria, Thara Gopinath, Andy Gross, Bjorn Andersson,
	Konrad Dybcio, Rafael J. Wysocki, Zhang Rui, Dmitry Baryshkov,
	Rob Herring, Krzysztof Kozlowski, Conor Dooley, linux-arm-msm,
	linux-pm, linux-kernel, devicetree, Stephan Gerhold,
	Krzysztof Kozlowski

Make the MDM9607 thermal sensor support consistent with Qualcomm's
vendor kernel (msm-3.18) by applying the correct default slope values
and adding "correction factors" to the factory calibration values in the
fuses. Use the same functionality to add the very similar MSM8909 SoC to
the tsens driver.

---
Changes in v4:
- Mostly just resend, explicitly initialize zero values for
  the MSM8909 p1/p2_calib_offset for better clarity (Konrad)
- Link to v3: https://lore.kernel.org/r/20230315103950.2679317-1-stephan.gerhold@kernkonzept.com
Changes in v3:
- Drop now unused definition reported by kernel test robot
Changes in v2:
- Rewrite on top of per-sensor nvmem cell changes that landed in 6.3
- Add patches to fix existing support for MDM9607

---
Stephan Gerhold (6):
      thermal: qcom: tsens: Drop unused legacy structs
      thermal: qcom: tsens-v0_1: Fix mdm9607 slope values
      thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets
      dt-bindings: thermal: qcom-tsens: Drop redundant compatibles
      dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible
      thermal: qcom: tsens-v0_1: Add MSM8909 data

 .../devicetree/bindings/thermal/qcom-tsens.yaml    | 23 +----
 drivers/thermal/qcom/tsens-v0_1.c                  | 99 +++++++++++++---------
 drivers/thermal/qcom/tsens-v1.c                    | 22 -----
 drivers/thermal/qcom/tsens.c                       | 19 ++++-
 drivers/thermal/qcom/tsens.h                       |  6 +-
 5 files changed, 84 insertions(+), 85 deletions(-)
---
base-commit: ac9a78681b921877518763ba0e89202254349d1b
change-id: 20230508-msm8909-tsens-6733a6d415be

Best regards,
-- 
Stephan Gerhold
Kernkonzept GmbH at Dresden, Germany, HRB 31129, CEO Dr.-Ing. Michael Hohmuth


^ permalink raw reply	[flat|nested] 10+ messages in thread

end of thread, other threads:[~2023-05-08 13:39 UTC | newest]

Thread overview: 10+ messages (download: mbox.gz follow: Atom feed
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2023-05-08 13:13 [PATCH v4 0/6] thermal: qcom: tsens: Fix MDM9607, add MSM8909 Stephan Gerhold
2023-05-08 13:13 ` [PATCH v4 1/6] thermal: qcom: tsens: Drop unused legacy structs Stephan Gerhold
2023-05-08 13:13 ` [PATCH v4 2/6] thermal: qcom: tsens-v0_1: Fix mdm9607 slope values Stephan Gerhold
2023-05-08 13:27   ` Dmitry Baryshkov
2023-05-08 13:13 ` [PATCH v4 3/6] thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets Stephan Gerhold
2023-05-08 13:38   ` Dmitry Baryshkov
2023-05-08 13:13 ` [PATCH v4 4/6] dt-bindings: thermal: qcom-tsens: Drop redundant compatibles Stephan Gerhold
2023-05-08 13:13 ` [PATCH v4 5/6] dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible Stephan Gerhold
2023-05-08 13:13 ` [PATCH v4 6/6] thermal: qcom: tsens-v0_1: Add MSM8909 data Stephan Gerhold
2023-05-08 13:34   ` Dmitry Baryshkov

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