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Wed, 21 Oct 2026 10:14:31 -0700 (PDT) Received: from linaro.org ([2a02:2454:ff25:4f10:9608:8385:755e:e1cc]) by smtp.gmail.com with ESMTPSA id 5b1f17b1804b1-4a203b42befsm4715775e9.8.2026.10.21.10.14.30 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Wed, 21 Oct 2026 10:14:31 -0700 (PDT) Date: Wed, 21 Oct 2026 19:14:25 +0200 From: Stephan Gerhold To: Daniel Lezcano , konradybcio@kernel.org Cc: andersson@kernel.org, robh@kernel.org, krzk+dt@kernel.org, johannes.goede@oss.qualcomm.com, conor+dt@kernel.org, linux-arm-msm@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, Mark Pearson Subject: Re: [PATCH v3] arm64: dts: qcom: x1e78100-thinkpad-t14s: Add thermal zones for PMICs Message-ID: References: <20261014193524.5590-1-daniel.lezcano@oss.qualcomm.com> <2d885d41-7d05-458c-8364-e206dab12792@oss.qualcomm.com> X-Mailing-List: devicetree@vger.kernel.org List-Id: List-Post: List-Help: List-Subscribe: List-Unsubscribe: List-Owner: Precedence: list MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <2d885d41-7d05-458c-8364-e206dab12792@oss.qualcomm.com> On Wed, Oct 21, 2026 at 06:20:55PM +0200, Daniel Lezcano wrote: > On 10/21/26 10:49, Stephan Gerhold wrote: > > On Tue, Oct 20, 2026 at 06:08:56PM +0200, Daniel Lezcano wrote: > > > > > > Thanks Stephan for the additional information, that's very helpful. > > > > > > We currently have an urgent thermal issue on this platform, and getting this > > > thermal mitigation upstream is important to prevent overheating under > > > sustained workloads. > > > > > > Would it be acceptable to address the sensor naming and description > > > improvements in a follow-up patch, so that we can get the thermal protection > > > in place first? > > > > > > Of course, if any of these changes are critical for the correctness of the > > > thermal mitigation, we should address them now. > > > > > > > I have no intention to delay this patch. In fact, since I'm using the > > latest unmodified stable kernel on my T14s, I'm also suffering from > > these thermal issues. :-) > > > > On the other hand, we are at the beginning of the merge window and Bjorn > > is unlikely to queue patches until that ends. The changes that > > I suggested are purely cosmetic (the names of the thermal zones), there > > is no need to repeat the thermal validation. The throttling behavior > > will be identical no matter which name is used for the thermal zones. > > > > IMO we should use the remaining time until the merge window ends to > > correct the naming to avoid any confusion for people reading the patch > > once it lands. > > Ok, fair enough > > I propose the following names for the thermal zone: > > dram-board-thermal > gpu-board-thermal > fan-board-thermal > wwan-board-thermal > chg-board-thermal > cpu-board-thermal > typec-board-thermal > > so we can capture with the name the ones related to the non-on-die sensors > > Sounds good ? That works for me, I don't have a strong opinion about the naming (maybe @Konrad has?). I guess people reading this might mistakenly assume that these refer to separate "sub-boards" in the sense that there is a "mainboard", a "Type-C board", a "DRAM board", a "GPU board", etc. But I can't think of a better name either. :-) Thanks, Stephan