Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

[Krzysztof Kozlowski <krzk@kernel.org>]

On 20/02/2026 08:29, Gaurav Kohli wrote:
> 
> 
> On 2/11/2026 1:43 PM, Krzysztof Kozlowski wrote:
>> On 11/02/2026 08:37, Gaurav Kohli wrote:
>>>
>>>
>>> On 2/8/2026 3:36 PM, Krzysztof Kozlowski wrote:
>>>> On 29/01/2026 13:06, Gaurav Kohli wrote:
>>>>>
>>>>> On 1/28/2026 4:57 PM, Krzysztof Kozlowski wrote:
>>>>>> On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
>>>>>>> The cooling subnode of a remoteproc represents a client of the Thermal
>>>>>>> Mitigation Device QMI service running on it. Each subnode of the cooling
>>>>>>> node represents a single control exposed by the service.
>>>>>>>
>>>>>>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>>>>>>> ---
>>>>>>>     .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
>>>>>>>     .../bindings/thermal/qcom,qmi-cooling.yaml    | 72 +++++++++++++++++++
>>>>>>>     2 files changed, 78 insertions(+)
>>>>>>>     create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>>>>>>>
>>>>>>> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>>>>>>> index 68c17bf18987..6a736161d5ae 100644
>>>>>>> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>>>>>>> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>>>>>>> @@ -80,6 +80,12 @@ properties:
>>>>>>>           and devices related to the ADSP.
>>>>>>>         unevaluatedProperties: false
>>>>>>>     
>>>>>>> +  cooling:
>>>>>>> +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
>>>>>>> +    description:
>>>>>>> +      Cooling subnode which represents the cooling devices exposed by the Modem.
>>>>>> I do not see the reason why you need 3 (!!!) children here. Everything
>>>>>> should be folded here.
>>>>>
>>>>>
>>>>> Thanks Krzysztof for review.
>>>>>
>>>>> Each subsystem may support multiple thermal mitigation devices through
>>>>> remote TMD service.
>>>>>
>>>>> Because of this multiplicity, introduced separate binding file.
>>>>
>>>> This explains nothing. Subsystem does not matter for the binding. My
>>>> comment stays.
>>>>
>>>
>>> thanks for this suggestion, we will use qcom,pas-common.yaml to define
>>> bindings and avoid creating new file.
>>
>> I asked not to create any children nodes.
>>
> 
> We have multiple cores within a subsystem(cdsp) and each core has its 
> own independent DCVS. And also we have dedicated TSENS sensor placed on 
> each core within the subsystem.

Your own example in this patch had only one device, so how do you
imagine to convince us with incomplete or half baked code?

> As a result, each core requires its own cooling device, which must be 
> linked to its TSENS thermal zone. Because of this, we introduced 
> multiple child nodes—one for each cooling device.

So you have one device with cooling cells=1+2, no?

> 
Best regards,
Krzysztof