Re: [PATCH v2] dt-bindings: thermal: qcom-tsens: Document the Maili Temperature Sensor

[Jingyi Wang <jingyi.wang@oss.qualcomm.com>]

Hi Daniel,

Gentle remind the pickup the patch.
just checked that it can apply cleanly on the latest linux-next tag.

Thanks,
Jingyi

On 6/19/2026 6:20 PM, Haritha S K wrote:
> Document the Temperature Sensor (TSENS) on the Qualcomm Maili SoC.
> 
> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
> Signed-off-by: Haritha S K <haritha.k@oss.qualcomm.com>
> ---
> Changes in v2:
> - Updated commit message.
> - Link to v1: https://patch.msgid.link/20260617-b4-maili-upstream-3-v1-1-1b8cb7e425d8@oss.qualcomm.com
> ---
>   Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>   1 file changed, 1 insertion(+)
> 
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> index f0efaa8349ee..5a8f7673e730 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -58,6 +58,7 @@ properties:
>                 - qcom,glymur-tsens
>                 - qcom,hawi-tsens
>                 - qcom,kaanapali-tsens
> +              - qcom,maili-tsens
>                 - qcom,milos-tsens
>                 - qcom,nord-tsens
>                 - qcom,msm8953-tsens
> 
> ---
> base-commit: a76326dca329a7a738ba367529868dfbafb4a403
> change-id: 20260616-b4-maili-upstream-3-b198aaa8969f
> 
> Best regards,
> --
> Haritha S K <haritha.k@oss.qualcomm.com>
> 
>