Re: [PATCH v5 1/9] dt-bindings: remoteproc: qcom,pas: add #cooling-cells property

[Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>]

On 7/22/2026 12:36 PM, Krzysztof Kozlowski wrote:
> On Tue, Jul 21, 2026 at 11:58:58AM +0530, Gaurav Kohli wrote:
>> Document the optional #cooling-cells property for Qualcomm PAS
>> remoteproc nodes so they can be used as thermal cooling devices via
>> the QMI Thermal Mitigation Device (TMD) interface.
>>
>> Qualcomm remote processors expose TMD endpoints that support thermal
>> throttling through firmware. The cooling-device specifier uses 3 cells:
>>
>>    <&phandle device_id min_state max_state>
>>
>> where device_id selects the TMD endpoint (for example PA, modem, or
>> CDSP software mitigation), with constants defined in:
>> include/dt-bindings/thermal/qcom,qmi-tmd.h
>>
>> Example usage in a thermal zone:
>>
>>    cooling-maps {
>>        map0 {
>>            trip = <&cpu_alert>;
>>            cooling-device = <&remoteproc_cdsp
>>                             QCOM_TMD_CDSP_SW
>>                             0 THERMAL_NO_LIMIT>;
>>        };
>>    };
>>
>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>> ---
>>   .../bindings/remoteproc/qcom,pas-common.yaml         |  9 +++++++++
>>   MAINTAINERS                                          |  1 +
>>   include/dt-bindings/thermal/qcom,qmi-tmd.h           | 20 ++++++++++++++++++++
>>   3 files changed, 30 insertions(+)
>>
>> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> index 11faf655f530..39e79a1c1079 100644
>> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> @@ -77,6 +77,15 @@ properties:
>>         channels and devices related to the ADSP.
>>       unevaluatedProperties: false
>>   
>> +  '#cooling-cells':
>> +    description: |
>> +      Cooling device with three cells:
>> +        Cell 0: Cooling device id as defined in
>> +                include/dt-bindings/thermal/qcom,qmi-tmd.h
>> +        Cell 1: Minimum cooling state
>> +        Cell 2: Maximum cooling state
>> +    const: 3
>> +
>>     glink-edge:
>>       $ref: /schemas/remoteproc/qcom,glink-edge.yaml#
>>       description:
>> diff --git a/MAINTAINERS b/MAINTAINERS
>> index dcffe9fc54f6..2d4d19201aec 100644
>> --- a/MAINTAINERS
>> +++ b/MAINTAINERS
>> @@ -3423,6 +3423,7 @@ F:	drivers/watchdog/gunyah_wdt.c
>>   F:	include/dt-bindings/arm/qcom,ids.h
>>   F:	include/dt-bindings/firmware/qcom,scm.h
>>   F:	include/dt-bindings/soc/qcom*
>> +F:	include/dt-bindings/thermal/qcom,qmi-tmd.h
>>   F:	include/linux/firmware/qcom
>>   F:	include/linux/soc/qcom/
>>   F:	include/soc/qcom/
>> diff --git a/include/dt-bindings/thermal/qcom,qmi-tmd.h b/include/dt-bindings/thermal/qcom,qmi-tmd.h
> 
> Filename must match compatible. There are no qcom,qmi-tmd or qcom,.*tmd
> or qcom,.*qmi compatibles.
> 
> Which device is providing this ABI? PAS?

thanks for review.
Yes, this belongs under PAS. Should i rename the file to pas?

> 
> Best regards,
> Krzysztof
>