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From: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
To: "Rafael J. Wysocki" <rafael@kernel.org>,
	Daniel Lezcano <daniel.lezcano@kernel.org>,
	Zhang Rui <rui.zhang@intel.com>,
	Lukasz Luba <lukasz.luba@arm.com>, Rob Herring <robh@kernel.org>,
	Krzysztof Kozlowski <krzk+dt@kernel.org>,
	Conor Dooley <conor+dt@kernel.org>,
	Jonathan Corbet <corbet@lwn.net>,
	Shuah Khan <skhan@linuxfoundation.org>,
	Randy Dunlap <rdunlap@infradead.org>,
	Amit Kucheria <amitk@kernel.org>,
	Thara Gopinath <thara.gopinath@gmail.com>,
	Bjorn Andersson <andersson@kernel.org>,
	Konrad Dybcio <konradybcio@kernel.org>,
	Abel Vesa <abelvesa@kernel.org>
Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org,
	linux-kernel@vger.kernel.org, linux-doc@vger.kernel.org,
	linux-arm-msm@vger.kernel.org,
	Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>,
	Amit Kucheria <amit.kucheria@oss.qualcomm.com>
Subject: [PATCH 3/6] dt-bindings: thermal: qcom-tsens: document qcm6490 tsens
Date: Fri, 02 Oct 2026 16:16:58 +0530	[thread overview]
Message-ID: <20261002-thermal_bin-v1-3-5a29be7e8ec5@oss.qualcomm.com> (raw)
In-Reply-To: <20261002-thermal_bin-v1-0-5a29be7e8ec5@oss.qualcomm.com>

From: Amit Kucheria <amit.kucheria@oss.qualcomm.com>

QCM6490 uses a tsens-v2 IP block and supports hardware-binned critical
trip points. Add its compatible to the tsens-v2 enum.

SoCs that support hardware-bin critical trips read their manufacturing
bin from qfprom fuse cells rather than the usual calibration cells: a
single "i-temp" bit on hamoa/purwa-class parts, and a "jtag-id"/
"feat-id" pair on sc7280/qcm6490. Extend nvmem-cell-names with two
oneOf branches so these fuse-cell names validate.

Signed-off-by: Amit Kucheria <amit.kucheria@oss.qualcomm.com>
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
---
 Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 8 ++++++++
 1 file changed, 8 insertions(+)

diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index 5a8f7673e730..6899f07ec218 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -65,6 +65,7 @@ properties:
               - qcom,msm8996-tsens
               - qcom,msm8998-tsens
               - qcom,qcm2290-tsens
+              - qcom,qcm6490-tsens
               - qcom,qcs8300-tsens
               - qcom,qcs615-tsens
               - qcom,sa8255p-tsens
@@ -244,6 +245,13 @@ properties:
           - pattern: '^tsens_sens[0-9]+_off$'
           - pattern: '^tsens_sens[0-9]+_off$'
           - pattern: '^tsens_sens[0-9]+_off$'
+        # hardware-binning fuse cells: a single i-temp bit
+      - items:
+          - const: i-temp
+        # hardware-binning fuse cells: jtag-id and feature-id
+      - items:
+          - const: jtag-id
+          - const: feat-id
 
   "#qcom,sensors":
     description:

-- 
2.34.1


  parent reply	other threads:[~2026-10-02 10:47 UTC|newest]

Thread overview: 7+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2026-10-02 10:46 [PATCH 0/6] thermal: Add hardware-binned trip point support Gaurav Kohli
2026-10-02 10:46 ` [PATCH 1/6] dt-bindings: thermal: thermal-zones: add hardware-binning trip properties Gaurav Kohli
2026-10-02 10:46 ` [PATCH 2/6] thermal: add hardware-binning trip-point filtering support Gaurav Kohli
2026-10-02 10:46 ` Gaurav Kohli [this message]
2026-10-02 10:46 ` [PATCH 4/6] thermal: qcom: tsens: add hardware-bin trip-point filtering Gaurav Kohli
2026-10-02 10:47 ` [PATCH 5/6] arm64: dts: qcom: kodiak: use thermal hw-bin trips Gaurav Kohli
2026-10-02 10:47 ` [PATCH 6/6] arm64: dts: qcom: hamoa: add thermal hw-bin support Gaurav Kohli

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