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([2a02:8071:b783:140:927c:82ba:d32d:99c1]) by smtp.gmail.com with ESMTPSA id 5b1f17b1804b1-429c750e57fsm10102405e9.12.2024.08.09.18.04.21 (version=TLS1_3 cipher=TLS_AES_128_GCM_SHA256 bits=128/128); Fri, 09 Aug 2024 18:04:21 -0700 (PDT) Message-ID: <4464d0f5-1a40-40b9-8d53-7f0d75b9d062@gmail.com> Date: Sat, 10 Aug 2024 03:04:20 +0200 Precedence: bulk X-Mailing-List: linux-hwmon@vger.kernel.org List-Id: List-Subscribe: List-Unsubscribe: MIME-Version: 1.0 User-Agent: Mozilla Thunderbird Subject: Re: [PATCH v2] hwmon: Add thermal sensor driver for Surface Aggregator Module To: Konrad Dybcio , Guenter Roeck Cc: Jean Delvare , Hans de Goede , Ivor Wanders , linux-kernel@vger.kernel.org, linux-hwmon@vger.kernel.org References: <20240804230832.247852-1-luzmaximilian@gmail.com> <6027d9db-b1a8-4eb0-a0b7-451f1524834c@kernel.org> Content-Language: en-US From: Maximilian Luz In-Reply-To: <6027d9db-b1a8-4eb0-a0b7-451f1524834c@kernel.org> Content-Type: text/plain; charset=UTF-8; format=flowed Content-Transfer-Encoding: 8bit On 8/10/24 1:35 AM, Konrad Dybcio wrote: > On 5.08.2024 1:08 AM, Maximilian Luz wrote: >> Some of the newer Microsoft Surface devices (such as the Surface Book >> 3 and Pro 9) have thermal sensors connected via the Surface Aggregator >> Module (the embedded controller on those devices). Add a basic driver >> to read out the temperature values of those sensors. >> >> The EC can have up to 16 thermal sensors connected via a single >> sub-device, each providing temperature readings and a label string. >> >> Link: https://github.com/linux-surface/surface-aggregator-module/issues/59 >> Reviewed-by: Hans de Goede >> Co-developed-by: Ivor Wanders >> Signed-off-by: Ivor Wanders >> Signed-off-by: Maximilian Luz >> >> --- > > Gave it a shot on SL7, some names are repeated and one sensor is > totally busted > > /sys/class/hwmon/hwmon66/name:surface_thermal > /sys/class/hwmon/hwmon66/temp10_input:32200 > /sys/class/hwmon/hwmon66/temp10_label:I_RTS2 > /sys/class/hwmon/hwmon66/temp11_input:31600 > /sys/class/hwmon/hwmon66/temp11_label:I_RTS3 > /sys/class/hwmon/hwmon66/temp12_input:38000 > /sys/class/hwmon/hwmon66/temp12_label:I_RTS4 > /sys/class/hwmon/hwmon66/temp1_input:43900 > /sys/class/hwmon/hwmon66/temp1_label:I_RTS1 > /sys/class/hwmon/hwmon66/temp2_input:44000 > /sys/class/hwmon/hwmon66/temp2_label:I_RTS2 > /sys/class/hwmon/hwmon66/temp3_input:47300 > /sys/class/hwmon/hwmon66/temp3_label:I_RTS3 > /sys/class/hwmon/hwmon66/temp4_input:-273100 > /sys/class/hwmon/hwmon66/temp4_label:I_RTS4 > /sys/class/hwmon/hwmon66/temp5_input:31300 > /sys/class/hwmon/hwmon66/temp5_label:I_RTS5 > /sys/class/hwmon/hwmon66/temp9_input:37100 > /sys/class/hwmon/hwmon66/temp9_label:I_RTS1 Hmm, on the SPX it looks like this: I_RTS1: +31.9°C I_RTS2: +31.3°C I_RTS3: +31.4°C I_RTS4: +28.3°C I_RTS5: +29.3°C I_RTS6: +29.3°C I_RTS7: +29.3°C I_RTS8: +29.3°C VTS1: +30.2°C VTS2: +0.0°C VTS3: +0.0°C VTS4: +0.0°C VTS5: +0.0°C So VTS2-5 seem like they may not actually be connected, but the rest at least look somewhat sensible. I'd probably still keep the names as they at least might give an indication what the sensors could be for. But there's a good chance that we're missing something on how MS envisions these sensors to work exactly. Regards, Max