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Date:   Thu, 12 Jan 2023 19:05:51 +0000
From:   Jonathan Cameron <jic23@kernel.org>
To:     Andrew Hepp <andrew.hepp@ahepp.dev>
Cc:     linux-iio@vger.kernel.org, linux-kernel@vger.kernel.org
Subject: Re: [PATCH v2] iio: temperature: Add MCP9600 thermocouple EMF
 converter driver
Message-ID: <20230112190551.4d9ac5f6@jic23-huawei>
In-Reply-To: <20230108234503.2803-1-andrew.hepp@ahepp.dev>
References: <Jonathan Cameron <jic23@kernel.org>
        <20230108234503.2803-1-andrew.hepp@ahepp.dev>
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On Sun,  8 Jan 2023 15:45:04 -0800
Andrew Hepp <andrew.hepp@ahepp.dev> wrote:

> From: "Andrew Hepp" <andrew.hepp@ahepp.dev>
> 
> Add support for the MCP9600 thermocouple EMF converter.
> 
> Datasheet: https://ww1.microchip.com/downloads/en/DeviceDoc/MCP960X-Data-Sheet-20005426.pdf
> Signed-off-by: Andrew Hepp <andrew.hepp@ahepp.dev>

Driver looks good, but now I realise we don't have a device tree binding doc.

Please add one for v3.

Note that the binding doc is describing the hardware, not what the driver
currently supports alone, so include the 4 (or 6?) interrupt lines (and interrupt-names
as any random subset of them might be provided) + VDD regulator + anything else I've
not noticed in my 10 second look at the datashet.

Thanks,

Jonathan