From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Subject: Re: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the thermal sensor in H3 and H5 To: Maxime Ripard Cc: lee.jones@linaro.org, robh+dt@kernel.org, mark.rutland@arm.com, wens@csie.org, linux@armlinux.org.uk, jic23@kernel.org, knaack.h@gmx.de, lars@metafoo.de, pmeerw@pmeerw.net, davem@davemloft.net, hans.verkuil@cisco.com, mchehab@kernel.org, rask@formelder.dk, clabbe.montjoie@gmail.com, sean@mess.org, krzk@kernel.org, quentin.schulz@free-electrons.com, icenowy@aosc.io, edu.molinas@gmail.com, singhalsimran0@gmail.com, linux-iio@vger.kernel.org, devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org, linux-sunxi@googlegroups.com References: <20180128232919.12639-1-embed3d@gmail.com> <20180128232919.12639-12-embed3d@gmail.com> <20180129094918.4fvxpmoftgxxkqg3@flea.lan> From: Philipp Rossak Message-ID: Date: Mon, 29 Jan 2018 12:54:26 +0100 MIME-Version: 1.0 In-Reply-To: <20180129094918.4fvxpmoftgxxkqg3@flea.lan> Content-Type: text/plain; charset=windows-1252; format=flowed List-ID: On 29.01.2018 10:49, Maxime Ripard wrote: > Hi, > > On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote: >> As we have gained the support for the thermal sensor in H3 and H5, >> we can now add its device nodes to the device tree. The H3 and H5 share >> most of its compatible. The compatible and the thermal sensor cells >> will be added in an additional patch per device. >> >> Signed-off-by: Philipp Rossak >> --- >> arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++ >> 1 file changed, 9 insertions(+) >> >> diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> index 7a83b15225c7..413c789b588d 100644 >> --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> @@ -426,6 +426,15 @@ >> }; >> }; >> >> + ths: thermal-sensor@1c25000 { >> + reg = <0x01c25000 0x100>; > > The size is 0x400 > > Maxime > Ok, I will fix this. Philipp