From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: rafael@kernel.org
Cc: linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org,
"Zhang Rui" <rui.zhang@intel.com>, "Len Brown" <lenb@kernel.org>,
"Damien Le Moal" <damien.lemoal@opensource.wdc.com>,
"Shawn Guo" <shawnguo@kernel.org>,
"Sascha Hauer" <s.hauer@pengutronix.de>,
"Pengutronix Kernel Team" <kernel@pengutronix.de>,
"Fabio Estevam" <festevam@gmail.com>,
"NXP Linux Team" <linux-imx@nxp.com>,
"Jean Delvare" <jdelvare@suse.com>,
"Guenter Roeck" <linux@roeck-us.net>,
"Jonathan Cameron" <jic23@kernel.org>,
"Lars-Peter Clausen" <lars@metafoo.de>,
"Chen-Yu Tsai" <wens@csie.org>,
"Jernej Skrabec" <jernej.skrabec@gmail.com>,
"Samuel Holland" <samuel@sholland.org>,
"Dmitry Torokhov" <dmitry.torokhov@gmail.com>,
"David S. Miller" <davem@davemloft.net>,
"Eric Dumazet" <edumazet@google.com>,
"Jakub Kicinski" <kuba@kernel.org>,
"Paolo Abeni" <pabeni@redhat.com>,
"Ido Schimmel" <idosch@nvidia.com>,
"Petr Machata" <petrm@nvidia.com>,
"Gregory Greenman" <gregory.greenman@intel.com>,
"Kalle Valo" <kvalo@kernel.org>,
"Sebastian Reichel" <sre@kernel.org>,
"Liam Girdwood" <lgirdwood@gmail.com>,
"Mark Brown" <broonie@kernel.org>,
"Miquel Raynal" <miquel.raynal@bootlin.com>,
"Amit Kucheria" <amitk@kernel.org>,
"Florian Fainelli" <f.fainelli@gmail.com>,
"Broadcom internal kernel review list"
<bcm-kernel-feedback-list@broadcom.com>,
"Ray Jui" <rjui@broadcom.com>,
"Scott Branden" <sbranden@broadcom.com>,
"Markus Mayer" <mmayer@broadcom.com>,
"Support Opensource" <support.opensource@diasemi.com>,
"Andy Gross" <agross@kernel.org>,
"Bjorn Andersson" <andersson@kernel.org>,
"Konrad Dybcio" <konrad.dybcio@linaro.org>,
"Thara Gopinath" <thara.gopinath@gmail.com>,
"Niklas Söderlund" <niklas.soderlund@ragnatech.se>,
"Heiko Stuebner" <heiko@sntech.de>,
"Bartlomiej Zolnierkiewicz" <bzolnier@gmail.com>,
"Krzysztof Kozlowski" <krzysztof.kozlowski@linaro.org>,
"Alim Akhtar" <alim.akhtar@samsung.com>,
"Orson Zhai" <orsonzhai@gmail.com>,
"Baolin Wang" <baolin.wang@linux.alibaba.com>,
"Chunyan Zhang" <zhang.lyra@gmail.com>,
"Vasily Khoruzhick" <anarsoul@gmail.com>,
"Yangtao Li" <tiny.windzz@gmail.com>,
"Thierry Reding" <thierry.reding@gmail.com>,
"Jonathan Hunter" <jonathanh@nvidia.com>,
"Talel Shenhar" <talel@amazon.com>,
"Eduardo Valentin" <edubezval@gmail.com>,
Keerthy <j-keerthy@ti.com>,
"Kunihiko Hayashi" <hayashi.kunihiko@socionext.com>,
"Masami Hiramatsu" <mhiramat@kernel.org>,
"Matthias Brugger" <matthias.bgg@gmail.com>,
"AngeloGioacchino Del Regno"
<angelogioacchino.delregno@collabora.com>,
"Stefan Wahren" <stefan.wahren@i2se.com>,
"Zheng Yongjun" <zhengyongjun3@huawei.com>,
"Yang Li" <yang.lee@linux.alibaba.com>,
"Srinivas Pandruvada" <srinivas.pandruvada@linux.intel.com>,
"Daniel Golle" <daniel@makrotopia.org>,
"Balsam CHIHI" <bchihi@baylibre.com>,
"Mikko Perttunen" <mperttunen@nvidia.com>,
linux-acpi@vger.kernel.org, linux-ide@vger.kernel.org,
linux-arm-kernel@lists.infradead.org,
linux-hwmon@vger.kernel.org, linux-iio@vger.kernel.org,
linux-sunxi@lists.linux.dev, linux-input@vger.kernel.org,
netdev@vger.kernel.org, linux-wireless@vger.kernel.org,
linux-rpi-kernel@lists.infradead.org,
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linux-rockchip@lists.infradead.org,
linux-samsung-soc@vger.kernel.org, linux-tegra@vger.kernel.org,
linux-omap@vger.kernel.org, linux-mediatek@lists.infradead.org
Subject: Re: [PATCH v5 00/18] Self-encapsulate the thermal zone device structure
Date: Fri, 3 Mar 2023 10:24:39 +0100 [thread overview]
Message-ID: <1d3da42e-2499-7ff6-50fa-048a720e855f@linaro.org> (raw)
In-Reply-To: <20230301201446.3713334-1-daniel.lezcano@linaro.org>
Hi Rafael,
Do we have enough ack to apply this series, is it for you ?
Thanks
-- Daniel
On 01/03/2023 21:14, Daniel Lezcano wrote:
> The exported thermal headers expose the thermal core structure while those
> should be private to the framework. The initial idea was the thermal sensor
> drivers use the thermal zone device structure pointer to pass it around from
> the ops to the thermal framework API like a handler.
>
> Unfortunately, different drivers are using and abusing the internals of this
> structure to hook the associated struct device, read the internals values, take
> the lock, etc ...
>
> In order to fix this situation, let's encapsulate the structure leaking the
> more in the different drivers: the thermal_zone_device structure.
>
> This series revisit the existing drivers using the thermal zone private
> structure internals to change the access to something else. For instance, the
> get_temp() ops is using the tz->dev to write a debug trace. Despite the trace
> is not helpful, we can check the return value for the get_temp() ops in the
> call site and show the message in this place.
>
> With this set of changes, the thermal_zone_device is almost self-encapsulated.
> As usual, the acpi driver needs a more complex changes, so that will come in a
> separate series along with the structure moved the private core headers.
>
> Changelog:
> - V5:
> - Dropped patch 19 : "thermal/tegra: Do not enable ... is already enabled"
> - Changed the init sequence of the hw channels on tegra3 to close
> the race window
> - Collected more tags
> - V4:
> - Collected more tags
> - Fixed a typo therma_zone_device_priv() for db8500
> - Remove traces patch [20/20] to be submitted separetely
> - V3:
> - Split the first patch into three to reduce the number of
> recipients per change
> - Collected more tags
> - Added missing changes for ->devdata in some drivers
> - Added a 'type' accessor
> - Replaced the 'type' to 'id' changes by the 'type' accessor
> - Used the 'type' accessor in the drivers
> - V2:
> - Collected tags
> - Added missing changes for ->devdata for the tsens driver
> - Renamed thermal_zone_device_get_data() to thermal_zone_priv()
> - Added stubs when CONFIG_THERMAL is not set
> - Dropped hwmon change where we remove the tz->lock usage
>
> Thank you all for your comments
>
> Cc: "Rafael J. Wysocki" <rafael@kernel.org>
> Cc: Zhang Rui <rui.zhang@intel.com>
> Cc: Len Brown <lenb@kernel.org>
> Cc: Damien Le Moal <damien.lemoal@opensource.wdc.com>
> Cc: Shawn Guo <shawnguo@kernel.org>
> Cc: Sascha Hauer <s.hauer@pengutronix.de>
> Cc: Pengutronix Kernel Team <kernel@pengutronix.de>
> Cc: Fabio Estevam <festevam@gmail.com>
> Cc: NXP Linux Team <linux-imx@nxp.com>
> Cc: Jean Delvare <jdelvare@suse.com>
> Cc: Guenter Roeck <linux@roeck-us.net>
> Cc: Jonathan Cameron <jic23@kernel.org>
> Cc: Lars-Peter Clausen <lars@metafoo.de>
> Cc: Chen-Yu Tsai <wens@csie.org>
> Cc: Jernej Skrabec <jernej.skrabec@gmail.com>
> Cc: Samuel Holland <samuel@sholland.org>
> Cc: Dmitry Torokhov <dmitry.torokhov@gmail.com>
> Cc: "David S. Miller" <davem@davemloft.net>
> Cc: Eric Dumazet <edumazet@google.com>
> Cc: Jakub Kicinski <kuba@kernel.org>
> Cc: Paolo Abeni <pabeni@redhat.com>
> Cc: Ido Schimmel <idosch@nvidia.com>
> Cc: Petr Machata <petrm@nvidia.com>
> Cc: Gregory Greenman <gregory.greenman@intel.com>
> Cc: Kalle Valo <kvalo@kernel.org>
> Cc: Sebastian Reichel <sre@kernel.org>
> Cc: Liam Girdwood <lgirdwood@gmail.com>
> Cc: Mark Brown <broonie@kernel.org>
> Cc: Miquel Raynal <miquel.raynal@bootlin.com>
> Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
> Cc: Amit Kucheria <amitk@kernel.org>
> Cc: Florian Fainelli <f.fainelli@gmail.com>
> Cc: Broadcom internal kernel review list <bcm-kernel-feedback-list@broadcom.com>
> Cc: Ray Jui <rjui@broadcom.com>
> Cc: Scott Branden <sbranden@broadcom.com>
> Cc: Markus Mayer <mmayer@broadcom.com>
> Cc: Support Opensource <support.opensource@diasemi.com>
> Cc: Andy Gross <agross@kernel.org>
> Cc: Bjorn Andersson <andersson@kernel.org>
> Cc: Konrad Dybcio <konrad.dybcio@linaro.org>
> Cc: Thara Gopinath <thara.gopinath@gmail.com>
> Cc: "Niklas Söderlund" <niklas.soderlund@ragnatech.se>
> Cc: Heiko Stuebner <heiko@sntech.de>
> Cc: Bartlomiej Zolnierkiewicz <bzolnier@gmail.com>
> Cc: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
> Cc: Alim Akhtar <alim.akhtar@samsung.com>
> Cc: Orson Zhai <orsonzhai@gmail.com>
> Cc: Baolin Wang <baolin.wang@linux.alibaba.com>
> Cc: Chunyan Zhang <zhang.lyra@gmail.com>
> Cc: Vasily Khoruzhick <anarsoul@gmail.com>
> Cc: Yangtao Li <tiny.windzz@gmail.com>
> Cc: Thierry Reding <thierry.reding@gmail.com>
> Cc: Jonathan Hunter <jonathanh@nvidia.com>
> Cc: Talel Shenhar <talel@amazon.com>
> Cc: Eduardo Valentin <edubezval@gmail.com>
> Cc: Keerthy <j-keerthy@ti.com>
> Cc: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
> Cc: Masami Hiramatsu <mhiramat@kernel.org>
> Cc: Matthias Brugger <matthias.bgg@gmail.com>
> Cc: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
> Cc: Stefan Wahren <stefan.wahren@i2se.com>
> Cc: Zheng Yongjun <zhengyongjun3@huawei.com>
> Cc: Yang Li <yang.lee@linux.alibaba.com>
> Cc: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
> Cc: Daniel Golle <daniel@makrotopia.org>
> Cc: Balsam CHIHI <bchihi@baylibre.com>
> Cc: Mikko Perttunen <mperttunen@nvidia.com>
> Cc: linux-acpi@vger.kernel.org
> Cc: linux-kernel@vger.kernel.org
> Cc: linux-ide@vger.kernel.org
> Cc: linux-arm-kernel@lists.infradead.org
> Cc: linux-hwmon@vger.kernel.org
> Cc: linux-iio@vger.kernel.org
> Cc: linux-sunxi@lists.linux.dev
> Cc: linux-input@vger.kernel.org
> Cc: netdev@vger.kernel.org
> Cc: linux-wireless@vger.kernel.org
> Cc: linux-pm@vger.kernel.org
> Cc: linux-rpi-kernel@lists.infradead.org
> Cc: linux-arm-msm@vger.kernel.org
> Cc: linux-renesas-soc@vger.kernel.org
> Cc: linux-rockchip@lists.infradead.org
> Cc: linux-samsung-soc@vger.kernel.org
> Cc: linux-tegra@vger.kernel.org
> Cc: linux-omap@vger.kernel.org
> Cc: linux-mediatek@lists.infradead.org
>
> Daniel Lezcano (18):
> thermal/core: Add a thermal zone 'devdata' accessor
> thermal/core: Use the thermal zone 'devdata' accessor in thermal
> located drivers
> thermal/core: Use the thermal zone 'devdata' accessor in hwmon located
> drivers
> thermal/core: Use the thermal zone 'devdata' accessor in remaining
> drivers
> thermal/core: Show a debug message when get_temp() fails
> thermal: Remove debug or error messages in get_temp() ops
> thermal/hwmon: Do not set no_hwmon before calling
> thermal_add_hwmon_sysfs()
> thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()
> thermal: Don't use 'device' internal thermal zone structure field
> thermal/core: Add thermal_zone_device structure 'type' accessor
> thermal/drivers/spear: Don't use tz->device but pdev->dev
> thermal: Add a thermal zone id accessor
> thermal: Use thermal_zone_device_type() accessor
> thermal/drivers/da9062: Don't access the thermal zone device fields
> thermal/hwmon: Use the thermal_core.h header
> thermal/drivers/tegra: Remove unneeded lock when setting a trip point
> thermal/drivers/acerhdf: Make interval setting only at module load
> time
> thermal/drivers/acerhdf: Remove pointless governor test
>
> drivers/acpi/thermal.c | 18 +++----
> drivers/ata/ahci_imx.c | 2 +-
> drivers/hwmon/hwmon.c | 4 +-
> drivers/hwmon/pmbus/pmbus_core.c | 2 +-
> drivers/hwmon/scmi-hwmon.c | 4 +-
> drivers/hwmon/scpi-hwmon.c | 2 +-
> drivers/iio/adc/sun4i-gpadc-iio.c | 2 +-
> drivers/input/touchscreen/sun4i-ts.c | 2 +-
> .../ethernet/chelsio/cxgb4/cxgb4_thermal.c | 2 +-
> .../ethernet/mellanox/mlxsw/core_thermal.c | 16 +++----
> drivers/net/wireless/intel/iwlwifi/mvm/tt.c | 4 +-
> drivers/platform/x86/acerhdf.c | 19 ++------
> drivers/power/supply/power_supply_core.c | 2 +-
> drivers/regulator/max8973-regulator.c | 2 +-
> drivers/thermal/amlogic_thermal.c | 4 +-
> drivers/thermal/armada_thermal.c | 14 ++----
> drivers/thermal/broadcom/bcm2711_thermal.c | 3 +-
> drivers/thermal/broadcom/bcm2835_thermal.c | 3 +-
> drivers/thermal/broadcom/brcmstb_thermal.c | 8 ++--
> drivers/thermal/broadcom/ns-thermal.c | 2 +-
> drivers/thermal/broadcom/sr-thermal.c | 2 +-
> drivers/thermal/da9062-thermal.c | 13 +++--
> drivers/thermal/db8500_thermal.c | 2 +-
> drivers/thermal/dove_thermal.c | 7 +--
> drivers/thermal/hisi_thermal.c | 5 +-
> drivers/thermal/imx8mm_thermal.c | 4 +-
> drivers/thermal/imx_sc_thermal.c | 9 ++--
> drivers/thermal/imx_thermal.c | 47 +++++--------------
> .../intel/int340x_thermal/int3400_thermal.c | 2 +-
> .../int340x_thermal/int340x_thermal_zone.c | 4 +-
> .../processor_thermal_device_pci.c | 4 +-
> drivers/thermal/intel/intel_pch_thermal.c | 2 +-
> .../thermal/intel/intel_quark_dts_thermal.c | 6 +--
> drivers/thermal/intel/intel_soc_dts_iosf.c | 13 ++---
> drivers/thermal/intel/x86_pkg_temp_thermal.c | 4 +-
> drivers/thermal/k3_bandgap.c | 4 +-
> drivers/thermal/k3_j72xx_bandgap.c | 2 +-
> drivers/thermal/kirkwood_thermal.c | 7 +--
> drivers/thermal/max77620_thermal.c | 6 +--
> drivers/thermal/mediatek/auxadc_thermal.c | 4 +-
> drivers/thermal/mediatek/lvts_thermal.c | 10 ++--
> drivers/thermal/qcom/qcom-spmi-adc-tm5.c | 6 +--
> drivers/thermal/qcom/qcom-spmi-temp-alarm.c | 6 +--
> drivers/thermal/qcom/tsens.c | 6 +--
> drivers/thermal/qoriq_thermal.c | 4 +-
> drivers/thermal/rcar_gen3_thermal.c | 5 +-
> drivers/thermal/rcar_thermal.c | 8 +---
> drivers/thermal/rockchip_thermal.c | 8 +---
> drivers/thermal/rzg2l_thermal.c | 3 +-
> drivers/thermal/samsung/exynos_tmu.c | 4 +-
> drivers/thermal/spear_thermal.c | 10 ++--
> drivers/thermal/sprd_thermal.c | 2 +-
> drivers/thermal/st/st_thermal.c | 5 +-
> drivers/thermal/st/stm_thermal.c | 4 +-
> drivers/thermal/sun8i_thermal.c | 4 +-
> drivers/thermal/tegra/soctherm.c | 6 +--
> drivers/thermal/tegra/tegra-bpmp-thermal.c | 6 ++-
> drivers/thermal/tegra/tegra30-tsensor.c | 31 ++++++------
> drivers/thermal/thermal-generic-adc.c | 7 ++-
> drivers/thermal/thermal_core.c | 18 +++++++
> drivers/thermal/thermal_helpers.c | 3 ++
> drivers/thermal/thermal_hwmon.c | 9 ++--
> drivers/thermal/thermal_hwmon.h | 4 +-
> drivers/thermal/thermal_mmio.c | 2 +-
> .../ti-soc-thermal/ti-thermal-common.c | 10 ++--
> drivers/thermal/uniphier_thermal.c | 2 +-
> include/linux/thermal.h | 19 ++++++++
> 67 files changed, 218 insertions(+), 246 deletions(-)
>
--
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next prev parent reply other threads:[~2023-03-03 9:25 UTC|newest]
Thread overview: 4+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-03-01 20:14 [PATCH v5 00/18] Self-encapsulate the thermal zone device structure Daniel Lezcano
2023-03-01 20:14 ` [PATCH v5 04/18] thermal/core: Use the thermal zone 'devdata' accessor in remaining drivers Daniel Lezcano
2023-03-03 9:24 ` Daniel Lezcano [this message]
2023-03-03 19:48 ` [PATCH v5 00/18] Self-encapsulate the thermal zone device structure Rafael J. Wysocki
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