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Date:   Sat, 19 Aug 2023 21:05:24 +0200
From:   Simon Horman <horms@kernel.org>
To:     Keguang Zhang <keguang.zhang@gmail.com>
Cc:     netdev@vger.kernel.org, devicetree@vger.kernel.org,
        linux-mips@vger.kernel.org, linux-kernel@vger.kernel.org,
        Lee Jones <lee@kernel.org>, Rob Herring <robh+dt@kernel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
        Conor Dooley <conor+dt@kernel.org>,
        "David S . Miller" <davem@davemloft.net>,
        Eric Dumazet <edumazet@google.com>,
        Jakub Kicinski <kuba@kernel.org>,
        Paolo Abeni <pabeni@redhat.com>,
        Thomas Bogendoerfer <tsbogend@alpha.franken.de>,
        Giuseppe Cavallaro <peppe.cavallaro@st.com>,
        Alexandre Torgue <alexandre.torgue@foss.st.com>,
        Jose Abreu <joabreu@synopsys.com>,
        Serge Semin <Sergey.Semin@baikalelectronics.ru>
Subject: Re: [PATCH v2 3/4] net: stmmac: Add glue layer for Loongson-1 SoC
Message-ID: <ZOESdApO8NN8kDQc@vergenet.net>
References: <20230816111310.1656224-1-keguang.zhang@gmail.com>
 <20230816111310.1656224-4-keguang.zhang@gmail.com>
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On Wed, Aug 16, 2023 at 07:13:09PM +0800, Keguang Zhang wrote:
> This glue driver is created based on the arch-code
> implemented earlier with the platform-specific settings.
> 
> Use syscon for SYSCON register access.
> 
> Partialy based on the previous work by Serge Semin.

Hi Keguang Zhang,

as it looks like there will be a v3 for other reasons,
a minor nit from my side: Partialy -> Partially

...