RE: [PATCH v3 15/23] mtd: spi-nor: winbond: Prepare introduction of W25QxxRV-M parts

From: <Takahiro.Kuwano@infineon.com>
To: <miquel.raynal@bootlin.com>, <pratyush@kernel.org>,
	<mwalle@kernel.org>, <richard@nod.at>, <vigneshr@ti.com>,
	<nicolas.ferre@microchip.com>, <alexandre.belloni@bootlin.com>,
	<claudiu.beznea@tuxon.dev>, <corbet@lwn.net>,
	<skhan@linuxfoundation.org>
Cc: <STLin2@winbond.com>, <hsinyi@chromium.org>,
	<thomas.petazzoni@bootlin.com>, <linux-mtd@lists.infradead.org>,
	<linux-arm-kernel@lists.infradead.org>,
	<linux-kernel@vger.kernel.org>, <linux-doc@vger.kernel.org>
Subject: RE: [PATCH v3 15/23] mtd: spi-nor: winbond: Prepare introduction of W25QxxRV-M parts
Date: Thu, 20 Aug 2026 06:18:22 +0000	[thread overview]
Message-ID: <2556eaef1ad346518e169552d60474ed@infineon.com> (raw)
In-Reply-To: <20260813-winbond-v7-1-spi-nor-rv-addition-v3-15-b637cf120d5c@bootlin.com>

> There is an ID collision between the JV and RV families. Both chips are
> very similar in practice, it is mostly a matter of electrical
> differences (mostly power consumption being lower).
> 
> As a significant difference, RV chips identify themselves as supporting
> The new SFDP (rev F) field which forces an alternate write SR2 opcode
> (0x31).
> 
> Since they share the IDs but not the names, we must hide the names using
> a fixup.
> 
> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>

Reviewed-by: Takahiro Kuwano <takahiro.kuwano@infineon.com>

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