From: Felipe Balbi <balbi@ti.com>
To: Tony Lindgren <tony@atomide.com>
Cc: linux-usb@vger.kernel.org, Jim Davis <jim.epost@gmail.com>,
Linus Walleij <linus.walleij@linaro.org>,
linux-omap@vger.kernel.org
Subject: Re: [PATCH] usb: musb: Fix randconfig build issues for Kconfig options
Date: Mon, 1 Dec 2014 13:14:26 -0600 [thread overview]
Message-ID: <20141201191425.GH9264@saruman> (raw)
In-Reply-To: <20141201191015.GC2817@atomide.com>
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On Mon, Dec 01, 2014 at 11:10:15AM -0800, Tony Lindgren wrote:
> Commit 82c02f58ba3a ("usb: musb: Allow multiple glue layers to be
> built in") enabled selecting multiple glue layers, which in turn
> exposed things more for randconfig builds. If NOP_USB_XCEIV is
> built-in and TUSB6010 is a loadable module, we will get:
>
> drivers/built-in.o: In function `tusb_remove':
> tusb6010.c:(.text+0x16a817): undefined reference to `usb_phy_generic_unregister'
> drivers/built-in.o: In function `tusb_probe':
> tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
> make: *** [vmlinux] Error 1
>
> Let's fix this the same way as commit 70c1ff4b3c86 ("usb: musb:
> tusb-dma can't be built-in if tusb is not").
>
> And while at it, let's not allow selecting the glue layers except
> on platforms really using them unless COMPILE_TEST is specified:
>
> - TUSB6010 is in practise only used on omaps
>
> - DSPS is only used on TI platforms
>
> - UX500 is only used on STE platforms
>
> Cc: Linus Walleij <linus.walleij@linaro.org>
> Reported-by: Jim Davis <jim.epost@gmail.com>
> Signed-off-by: Tony Lindgren <tony@atomide.com>
>
> ---
>
> Felipe, this is against current linux next for v3.19
since this is actually an old bug which just showed up, I'll defer this
to v3.19-rc1.
--
balbi
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prev parent reply other threads:[~2014-12-01 19:14 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
2014-12-01 19:10 [PATCH] usb: musb: Fix randconfig build issues for Kconfig options Tony Lindgren
2014-12-01 19:14 ` Felipe Balbi [this message]
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