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* [PATCH] usb: musb: Fix randconfig build issues for Kconfig options
@ 2014-12-01 19:10 Tony Lindgren
  2014-12-01 19:14 ` Felipe Balbi
  0 siblings, 1 reply; 2+ messages in thread
From: Tony Lindgren @ 2014-12-01 19:10 UTC (permalink / raw)
  To: linux-usb-u79uwXL29TY76Z2rM5mHXA
  Cc: Jim Davis, Linus Walleij, linux-omap-u79uwXL29TY76Z2rM5mHXA

Commit 82c02f58ba3a ("usb: musb: Allow multiple glue layers to be
built in") enabled selecting multiple glue layers, which in turn
exposed things more for randconfig builds. If NOP_USB_XCEIV is
built-in and TUSB6010 is a loadable module, we will get:

drivers/built-in.o: In function `tusb_remove':
tusb6010.c:(.text+0x16a817): undefined reference to `usb_phy_generic_unregister'
drivers/built-in.o: In function `tusb_probe':
tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
make: *** [vmlinux] Error 1

Let's fix this the same way as commit 70c1ff4b3c86 ("usb: musb:
tusb-dma can't be built-in if tusb is not").

And while at it, let's not allow selecting the glue layers except
on platforms really using them unless COMPILE_TEST is specified:

- TUSB6010 is in practise only used on omaps

- DSPS is only used on TI platforms

- UX500 is only used on STE platforms

Cc: Linus Walleij <linus.walleij-QSEj5FYQhm4dnm+yROfE0A@public.gmane.org>
Reported-by: Jim Davis <jim.epost-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org>
Signed-off-by: Tony Lindgren <tony-4v6yS6AI5VpBDgjK7y7TUQ@public.gmane.org>

---

Felipe, this is against current linux next for v3.19

--- a/drivers/usb/musb/Kconfig
+++ b/drivers/usb/musb/Kconfig
@@ -72,6 +72,8 @@ config USB_MUSB_DA8XX
 
 config USB_MUSB_TUSB6010
 	tristate "TUSB6010"
+	depends on ARCH_OMAP2PLUS || COMPILE_TEST
+	depends on NOP_USB_XCEIV = USB_MUSB_HDRC # both built-in or both modules
 
 config USB_MUSB_OMAP2PLUS
 	tristate "OMAP2430 and onwards"
@@ -85,6 +87,7 @@ config USB_MUSB_AM35X
 config USB_MUSB_DSPS
 	tristate "TI DSPS platforms"
 	select USB_MUSB_AM335X_CHILD
+	depends on ARCH_OMAP2PLUS || COMPILE_TEST
 	depends on OF_IRQ
 
 config USB_MUSB_BLACKFIN
@@ -93,6 +96,7 @@ config USB_MUSB_BLACKFIN
 
 config USB_MUSB_UX500
 	tristate "Ux500 platforms"
+	depends on ARCH_U8500 || COMPILE_TEST
 
 config USB_MUSB_JZ4740
 	tristate "JZ4740"
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^ permalink raw reply	[flat|nested] 2+ messages in thread

* Re: [PATCH] usb: musb: Fix randconfig build issues for Kconfig options
  2014-12-01 19:10 [PATCH] usb: musb: Fix randconfig build issues for Kconfig options Tony Lindgren
@ 2014-12-01 19:14 ` Felipe Balbi
  0 siblings, 0 replies; 2+ messages in thread
From: Felipe Balbi @ 2014-12-01 19:14 UTC (permalink / raw)
  To: Tony Lindgren; +Cc: linux-usb, Jim Davis, Linus Walleij, linux-omap

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On Mon, Dec 01, 2014 at 11:10:15AM -0800, Tony Lindgren wrote:
> Commit 82c02f58ba3a ("usb: musb: Allow multiple glue layers to be
> built in") enabled selecting multiple glue layers, which in turn
> exposed things more for randconfig builds. If NOP_USB_XCEIV is
> built-in and TUSB6010 is a loadable module, we will get:
> 
> drivers/built-in.o: In function `tusb_remove':
> tusb6010.c:(.text+0x16a817): undefined reference to `usb_phy_generic_unregister'
> drivers/built-in.o: In function `tusb_probe':
> tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
> make: *** [vmlinux] Error 1
> 
> Let's fix this the same way as commit 70c1ff4b3c86 ("usb: musb:
> tusb-dma can't be built-in if tusb is not").
> 
> And while at it, let's not allow selecting the glue layers except
> on platforms really using them unless COMPILE_TEST is specified:
> 
> - TUSB6010 is in practise only used on omaps
> 
> - DSPS is only used on TI platforms
> 
> - UX500 is only used on STE platforms
> 
> Cc: Linus Walleij <linus.walleij@linaro.org>
> Reported-by: Jim Davis <jim.epost@gmail.com>
> Signed-off-by: Tony Lindgren <tony@atomide.com>
> 
> ---
> 
> Felipe, this is against current linux next for v3.19

since this is actually an old bug which just showed up, I'll defer this
to v3.19-rc1.

-- 
balbi

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