From mboxrd@z Thu Jan 1 00:00:00 1970 From: Zhang Rui Subject: Re: [RFC PATCH 0/2] thermal: Add generic cpu cooling devices according to thermal framework Date: Fri, 03 Feb 2012 15:12:27 +0800 Message-ID: <1328253147.20438.19.camel@rui.sh.intel.com> References: <1323789196-4942-1-git-send-email-amit.kachhap@linaro.org> Mime-Version: 1.0 Content-Type: text/plain; charset=UTF-8 Content-Transfer-Encoding: QUOTED-PRINTABLE Return-path: In-Reply-To: Sender: linux-acpi-owner@vger.kernel.org To: Amit Kachhap Cc: linux-pm@lists.linux-foundation.org, linux-kernel@vger.kernel.org, mjg59@srcf.ucam.org, linux-acpi@vger.kernel.org, lenb@kernel.org, linaro-dev@lists.linaro.org, patches@linaro.org List-Id: linux-pm@vger.kernel.org Hi, sorry for the late response. On =E5=9B=9B, 2012-01-19 at 14:47 +0530, Amit Kachhap wrote: > On 13 December 2011 20:43, Amit Daniel Kachhap wrote: > > PATCH 1) [thermal: Add a new trip type to use cooling device insta= nce number] > > This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE which pas= ses > > cooling device instance number and may be helpful for cpufreq cooli= ng devices > > to take the correct cooling action. > > Sorry, I'm still not quite clear about how this will be used. Say, processor has P0~P3, then we need to register a thermal zone with three STATE_ACTIVE trip points, like the picture shown below? processor in full speed, i.e. P0 ----------------------------=20 state active trip point 1 ---------------------------- processor in P1 ---------------------------- state active trip point 2 ---------------------------- processor in P2 ---------------------------- state active trip point 3 ---------------------------- processor in P3 > > PATCH 2) [thermal: Add generic cpu cooling implementation] > > This patch adds generic cpu cooling low level implementation throug= h frequency > > clipping and cpu hotplug. In future, other cpu related cooling devi= ces may be > > added here. An ACPI version of this already exists(drivers/acpi/pro= cessor_thermal.c). > > But this will be useful for platforms like ARM using the generic th= ermal interface > > along with the generic cpu cooling devices. The cooling device regi= stration API's > > return cooling device pointers which can be easily binded with the = thermal zone > > trip points. > > It seems that we can convert the ACPI processor thermal driver to follo= w this generic cpu cooling implementation, right? thanks, rui >=20 > Any comments on these patches? I submitted them quite long back. >=20 > Regards, > Amit D >=20 > > > > Amit Daniel Kachhap (2): > > thermal: Add a new trip type to use cooling device instance number > > thermal: Add generic cpu cooling implementation > > > > Documentation/thermal/cpu-cooling-api.txt | 52 +++++ > > Documentation/thermal/sysfs-api.txt | 4 +- > > drivers/thermal/Kconfig | 11 + > > drivers/thermal/Makefile | 1 + > > drivers/thermal/cpu_cooling.c | 302 +++++++++++++++++= ++++++++++++ > > drivers/thermal/thermal_sys.c | 27 +++- > > include/linux/cpu_cooling.h | 45 +++++ > > include/linux/thermal.h | 1 + > > 8 files changed, 440 insertions(+), 3 deletions(-) > > create mode 100644 Documentation/thermal/cpu-cooling-api.txt > > create mode 100644 drivers/thermal/cpu_cooling.c > > create mode 100644 include/linux/cpu_cooling.h > > -- To unsubscribe from this list: send the line "unsubscribe linux-acpi" i= n the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html