From mboxrd@z Thu Jan 1 00:00:00 1970 From: "hongbo.zhang" Subject: [PATCH V4 0/2] Upstream ST-Ericsson thermal driver Date: Wed, 7 Nov 2012 18:23:00 +0800 Message-ID: <1352283782-16489-1-git-send-email-hongbo.zhang@linaro.com> Return-path: Received: from mail-pb0-f46.google.com ([209.85.160.46]:46122 "EHLO mail-pb0-f46.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751530Ab2KGKYG (ORCPT ); Wed, 7 Nov 2012 05:24:06 -0500 Received: by mail-pb0-f46.google.com with SMTP id rr4so1113964pbb.19 for ; Wed, 07 Nov 2012 02:24:05 -0800 (PST) Sender: linux-pm-owner@vger.kernel.org List-Id: linux-pm@vger.kernel.org To: linux-acpi@vger.kernel.org, rui.zhang@intel.com Cc: linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org, amit.kachhap@linaro.org, patches@linaro.org, linaro-dev@lists.linaro.org, linaro-kernel@lists.linaro.org, STEricsson_nomadik_linux@list.st.com, kernel@igloocommunity.org, "hongbo.zhang" From: "hongbo.zhang" V3->V4 Changes: 1. In previous patch set V3 "Fix thermal bugs and Upstream ST-Ericsson thermal driver", there were 5 patches in total, since the first 3 for fixing thermal layer bugs have been accepted by the maintainer, I'd like to send out the updated last 2 only this time, for upstreaming ST-Ericsson thermal driver. 2. In patch "Thermal: Add ST-Ericsson DB8500 thermal driver" - typo in commit message: diver -> driver; - add more explanation of device tree properties are optional or required. - in function db8500_thermal_match_cdev: remove cdev_name, use trip_points->cdev_name[i] directly instead; - in function db8500_cdev_bind: move cdev->ops->get_max_state(cdev, &max_state) out of for loop to call it only once; - in function db8500_thermal_parse_dt: update checking strlen(tmp_str) >= THERMAL_NAME_LENGTH - add Reviewed-by: Viresh Kumar - add Reviewed-by: Francesco Lavra 3. In patch "Thermal: Add ST-Ericsson DB8500 thermal properties and platform data" - add Reviewed-by: Viresh Kumar hongbo.zhang (2): Thermal: Add ST-Ericsson DB8500 thermal driver. Thermal: Add ST-Ericsson DB8500 thermal properties and platform data. .../devicetree/bindings/thermal/db8500-thermal.txt | 44 ++ arch/arm/boot/dts/dbx5x0.dtsi | 14 + arch/arm/boot/dts/snowball.dts | 31 ++ arch/arm/configs/u8500_defconfig | 2 + arch/arm/mach-ux500/board-mop500.c | 64 +++ drivers/thermal/Kconfig | 20 + drivers/thermal/Makefile | 2 + drivers/thermal/db8500_cpufreq_cooling.c | 108 +++++ drivers/thermal/db8500_thermal.c | 530 +++++++++++++++++++++ include/linux/platform_data/db8500_thermal.h | 38 ++ 10 files changed, 853 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/db8500-thermal.txt create mode 100644 drivers/thermal/db8500_cpufreq_cooling.c create mode 100644 drivers/thermal/db8500_thermal.c create mode 100644 include/linux/platform_data/db8500_thermal.h -- 1.7.11.3