Re: [PATCH V6 1/2] Thermal: Add ST-Ericsson DB8500 thermal driver.

[Zhang Rui <rui.zhang@intel.com>]

On Sun, 2012-11-18 at 15:29 +0100, Francesco Lavra wrote:
> On 11/15/2012 01:51 PM, Zhang Rui wrote:
> > On Thu, 2012-11-15 at 18:56 +0800, hongbo.zhang wrote:
> >> From: "hongbo.zhang" <hongbo.zhang@linaro.com>
> >>
> >> This driver is based on the thermal management framework in thermal_sys.c. A
> >> thermal zone device is created with the trip points to which cooling devices
> >> can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
> >> clipped down to cool the CPU, and other cooling devices can be added and bound
> >> to the trip points dynamically.  The platform specific PRCMU interrupts are
> >> used to active thermal update when trip points are reached.
> >>
> >> Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
> >> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
> >> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
> > 
> > Patch is refreshed and applied to thermal next.
> > refreshed patch attached.
> [...]
> > diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
> > index 99b6587..d96da07 100644
> > --- a/drivers/thermal/Kconfig
> > +++ b/drivers/thermal/Kconfig
> > @@ -101,5 +101,25 @@ config EXYNOS_THERMAL
> >  	  If you say yes here you get support for TMU (Thermal Managment
> >  	  Unit) on SAMSUNG EXYNOS series of SoC.
> >  
> > +config DB8500_THERMAL
> > +	bool "DB8500 thermal management"
> > +	depends on ARCH_U8500
> 
> Shouldn't it depend on THERMAL as well, as in Hongbo's original patch?
> 
all of these options are available only if CONFIG_THERMAL is set.
please refer to commit 72e198978223f2020f7f59a6e2520f2b7d005e72 in the
thermal next tree.

thanks,
rui
> > +	default y
> > +	help
> > +	  Adds DB8500 thermal management implementation according to the thermal
> > +	  management framework. A thermal zone with several trip points will be
> > +	  created. Cooling devices can be bound to the trip points to cool this
> > +	  thermal zone if trip points reached.
> > +
> > +config DB8500_CPUFREQ_COOLING
> > +	tristate "DB8500 cpufreq cooling"
> > +	depends on ARCH_U8500
> > +	depends on CPU_THERMAL
> > +	default y
> > +	help
> > +	  Adds DB8500 cpufreq cooling devices, and these cooling devices can be
> > +	  bound to thermal zone trip points. When a trip point reached, the
> > +	  bound cpufreq cooling device turns active to set CPU frequency low to
> > +	  cool down the CPU.
> >  
> >  endif
> 
> --
> Francesco