From: Zhang Rui <rui.zhang@intel.com>
To: linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org
Cc: amit.daniel@samsung.com, durgadoss.r@intel.com, andi@lisas.de,
Zhang Rui <rui.zhang@intel.com>
Subject: [RFC PATCH 0/5] Thermal: build all thermal framework code into thermal_sys module
Date: Wed, 27 Mar 2013 00:26:04 +0800 [thread overview]
Message-ID: <1364315169-15427-1-git-send-email-rui.zhang@intel.com> (raw)
A regression introduced by thermal governor feature
is reported in http://marc.info/?l=linux-kernel&m=136085598604095&w=2
And the root cause is that all the thermal governors can not be registered
successfully when the thermal framework is built as a module.
Thus I made this patch set to build all the thermal framework component,
including governors and cpu_cooling feature into one module so that all the
thermal features are loaded/unloaded altogether.
any comments?
thanks,
rui
next reply other threads:[~2013-03-26 16:26 UTC|newest]
Thread overview: 17+ messages / expand[flat|nested] mbox.gz Atom feed top
2013-03-26 16:26 Zhang Rui [this message]
2013-03-26 16:26 ` [RFC PATCH 1/5] Thermal: rename thermal_sys.c to thermal_core.c Zhang Rui
2013-03-26 16:56 ` R, Durgadoss
2013-03-26 17:08 ` Zhang Rui
2013-03-26 22:04 ` [RFC,1/5] " Eduardo Valentin
2013-03-28 2:40 ` Zhang Rui
2013-04-01 12:43 ` Eduardo Valentin
2013-04-01 13:09 ` R, Durgadoss
2013-03-26 16:26 ` [RFC PATCH 2/5] Thermal: thermal framework registration failure case cleanup Zhang Rui
2013-03-26 22:22 ` [RFC, " Eduardo Valentin
2013-03-26 16:26 ` [RFC PATCH 3/5] Thermal: build thermal governors into thermal_sys module Zhang Rui
2013-03-26 16:53 ` R, Durgadoss
2013-03-26 17:12 ` Zhang Rui
2013-03-26 22:31 ` [RFC,3/5] " Eduardo Valentin
2013-03-26 16:26 ` [RFC PATCH 4/5] Thermal: governor API cleanup Zhang Rui
2013-03-26 22:35 ` [RFC,4/5] " Eduardo Valentin
2013-03-26 16:26 ` [RFC PATCH 5/5] Thermal: build cpu_cooling code into thermal_sys module Zhang Rui
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