From mboxrd@z Thu Jan 1 00:00:00 1970 From: Zhang Rui Subject: [RFC PATCH 0/5] Thermal: build all thermal framework code into thermal_sys module Date: Wed, 27 Mar 2013 00:26:04 +0800 Message-ID: <1364315169-15427-1-git-send-email-rui.zhang@intel.com> Return-path: Received: from mga03.intel.com ([143.182.124.21]:57346 "EHLO mga03.intel.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S933031Ab3CZQ0P (ORCPT ); Tue, 26 Mar 2013 12:26:15 -0400 Sender: linux-pm-owner@vger.kernel.org List-Id: linux-pm@vger.kernel.org To: linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org Cc: amit.daniel@samsung.com, durgadoss.r@intel.com, andi@lisas.de, Zhang Rui A regression introduced by thermal governor feature is reported in http://marc.info/?l=linux-kernel&m=136085598604095&w=2 And the root cause is that all the thermal governors can not be registered successfully when the thermal framework is built as a module. Thus I made this patch set to build all the thermal framework component, including governors and cpu_cooling feature into one module so that all the thermal features are loaded/unloaded altogether. any comments? thanks, rui