From mboxrd@z Thu Jan 1 00:00:00 1970 From: Zhang Rui Subject: Re: [PATCH 0/7] thermal: ti-soc-thermal: fixes and DRA752 support Date: Thu, 13 Jun 2013 10:20:35 +0800 Message-ID: <1371090035.2135.7.camel@rzhang1-mobl4> References: <1369840066-20357-1-git-send-email-eduardo.valentin@ti.com> Mime-Version: 1.0 Content-Type: text/plain; charset="UTF-8" Content-Transfer-Encoding: 7bit Return-path: Received: from mga02.intel.com ([134.134.136.20]:25636 "EHLO mga02.intel.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1757182Ab3FMCVC (ORCPT ); Wed, 12 Jun 2013 22:21:02 -0400 In-Reply-To: <1369840066-20357-1-git-send-email-eduardo.valentin@ti.com> Sender: linux-pm-owner@vger.kernel.org List-Id: linux-pm@vger.kernel.org To: Eduardo Valentin Cc: linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org On Wed, 2013-05-29 at 11:07 -0400, Eduardo Valentin wrote: > Hello Rui, > > Here is a patch set for your consideration on ti-soc-thermal driver. > the whole patch set has been applied. thanks, rui > This patch set is mix of: > > (a) patches that were added to the staging tree post 3.10-rc1 but > were not included after the move from staging to thermal. This is > because your thermal tree is based of 3.10-rc1 and not staging/next > or linux-next/master. Thus the first two patches make sure the driver > under drivers/thermal/ti-soc-thermal has also the needed fixes. > > (b) patches containing fixes found during the addition of DRA752 > chip support. > > (c) patches adding the support to DRA752 chips. > > Please consider these too for 3.11. > > For those people interested in testing this patch set, it is based > on thermal/next and can also be found here: > https://git.gitorious.org/thermal-framework/thermal-framework.git thermal_work/ti-soc-thermal/fixes+dra752 > > All best, > > Eduardo Valentin (7): > thermal: ti-soc-thermal: update DT reference for OMAP5430 > thermal: ti-soc-thermal: remove external heat while extrapolating > hotspot > thermal: ti-soc-thermal: freeze FSM while computing trend > thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL > thermal: ti-soc-thermal: add thermal data for DRA752 chips > thermal: ti-soc-thermal: add dra752 chip to device table > thermal: ti-soc-thermal: add DT example for DRA752 chip > > .../devicetree/bindings/thermal/ti_soc_thermal.txt | 13 + > drivers/staging/ti-soc-thermal/dra752-bandgap.h | 280 ++++++++++++ > .../staging/ti-soc-thermal/dra752-thermal-data.c | 476 +++++++++++++++++++++ > drivers/thermal/ti-soc-thermal/Kconfig | 12 + > drivers/thermal/ti-soc-thermal/Makefile | 1 + > drivers/thermal/ti-soc-thermal/ti-bandgap.c | 29 +- > drivers/thermal/ti-soc-thermal/ti-bandgap.h | 5 + > drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 43 +- > drivers/thermal/ti-soc-thermal/ti-thermal.h | 6 + > 9 files changed, 842 insertions(+), 23 deletions(-) > create mode 100644 drivers/staging/ti-soc-thermal/dra752-bandgap.h > create mode 100644 drivers/staging/ti-soc-thermal/dra752-thermal-data.c >