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* [PATCHv5 RESEND 03/10] Thermal: Add cooling device APIs
@ 2014-01-17 13:27 Durgadoss R
  2014-01-17 13:27 ` [PATCHv5 RESEND 08/10] Thermal: Add Documentation to new APIs Durgadoss R
  2014-01-17 13:27 ` [PATCHv5 RESEND 09/10] Thermal: Add ABI Documentation for sysfs interfaces Durgadoss R
  0 siblings, 2 replies; 3+ messages in thread
From: Durgadoss R @ 2014-01-17 13:27 UTC (permalink / raw)
  To: rui.zhang, eduardo.valentin, linux-pm
  Cc: linux-kernel, hongbo.zhang, wni, Durgadoss R

This patch adds the cooling device APIs to the
new thermal framework. The register/unregister
APIs stay the same. Below are some minimal
changes:
 * Use DEVICE_ATTR_RO/RW macros
 * Add 'struct idr idr' to struct thermal_cooling_device
 * Tidy up the error handling paths in register API
 * Use thermal_cdev_register as API name, to keep
   THERMAL_V2 APIs along with the existing ones.
 * Use 'cdevX' as name for cooling_device so as
   to not collide with the existing ABI.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
---
 drivers/thermal/thermal_core_new.c |  184 ++++++++++++++++++++++++++++++++++++
 include/linux/thermal.h            |   12 +++
 2 files changed, 196 insertions(+)

diff --git a/drivers/thermal/thermal_core_new.c b/drivers/thermal/thermal_core_new.c
index b369a6f..463165c 100644
--- a/drivers/thermal/thermal_core_new.c
+++ b/drivers/thermal/thermal_core_new.c
@@ -39,15 +39,21 @@ MODULE_DESCRIPTION("Generic thermal management sysfs support v2");
 MODULE_LICENSE("GPL v2");
 
 static DEFINE_IDR(thermal_sensor_idr);
+static DEFINE_IDR(thermal_cdev_idr);
 
 static LIST_HEAD(thermal_sensor_list);
+static LIST_HEAD(thermal_cdev_list);
 
 static DEFINE_MUTEX(thermal_idr_lock);
 static DEFINE_MUTEX(sensor_list_lock);
+static DEFINE_MUTEX(cdev_list_lock);
 
 #define to_thermal_sensor(_dev) \
 	container_of(_dev, struct thermal_sensor, device)
 
+#define to_cooling_device(_dev)	\
+	container_of(_dev, struct thermal_cooling_device, device)
+
 static int get_idr(struct idr *idr, int *id)
 {
 	int ret;
@@ -168,10 +174,69 @@ threshold_store(struct device *dev, struct device_attribute *attr,
 	return ret ? ret : count;
 }
 
+static ssize_t
+type_show(struct device *dev, struct device_attribute *attr, char *buf)
+{
+	struct thermal_cooling_device *cdev = to_cooling_device(dev);
+
+	return sprintf(buf, "%s\n", cdev->type);
+}
+
+static ssize_t
+max_state_show(struct device *dev, struct device_attribute *attr, char *buf)
+{
+	struct thermal_cooling_device *cdev = to_cooling_device(dev);
+	unsigned long state;
+	int ret;
+
+	ret = cdev->ops->get_max_state(cdev, &state);
+	if (ret)
+		return ret;
+	return sprintf(buf, "%ld\n", state);
+}
+
+static ssize_t
+cur_state_show(struct device *dev, struct device_attribute *attr, char *buf)
+{
+	struct thermal_cooling_device *cdev = to_cooling_device(dev);
+	unsigned long state;
+	int ret;
+
+	ret = cdev->ops->get_cur_state(cdev, &state);
+	if (ret)
+		return ret;
+	return sprintf(buf, "%ld\n", state);
+}
+
+static ssize_t
+cur_state_store(struct device *dev, struct device_attribute *attr,
+		const char *buf, size_t count)
+{
+	struct thermal_cooling_device *cdev = to_cooling_device(dev);
+	unsigned long state;
+	int ret;
+
+	ret = sscanf(buf, "%ld\n", &state);
+	if (!ret)
+		return -EINVAL;
+
+	if ((long)state < 0)
+		return -EINVAL;
+
+	ret = cdev->ops->set_cur_state(cdev, state);
+
+	return ret ? ret : count;
+}
+
 /* Thermal sensor attributes */
 static DEVICE_ATTR_RO(name);
 static DEVICE_ATTR_RO(temp);
 
+/* Thermal cooling device attributes */
+static DEVICE_ATTR_RO(type);
+static DEVICE_ATTR_RO(max_state);
+static DEVICE_ATTR_RW(cur_state);
+
 /**
  * thermal_create_sensor_sysfs - create sysfs nodes for sensorX
  * @ts:		the thermal sensor
@@ -365,3 +430,122 @@ void thermal_sensor_unregister(struct thermal_sensor *ts)
 	return;
 }
 EXPORT_SYMBOL_GPL(thermal_sensor_unregister);
+
+/**
+ * thermal_cdev_register() - register a new thermal cooling device
+ * @type:      the thermal cooling device type.
+ * @devdata:   device private data.
+ * @ops:       standard thermal cooling devices callbacks.
+ *
+ * This interface function adds a new thermal cooling device to
+ * /sys/class/thermal/ folder as cooling_device[0-*].
+ *
+ * Return: a pointer to the created struct thermal_cooling_device or an
+ * ERR_PTR. Caller must check return value with IS_ERR*() helpers.
+ */
+struct thermal_cooling_device *thermal_cdev_register(char *type, void *devdata,
+				const struct thermal_cooling_device_ops *ops)
+{
+	struct thermal_cooling_device *cdev;
+	int result;
+
+	if (!type || (type && strlen(type) >= THERMAL_NAME_LENGTH))
+		return ERR_PTR(-EINVAL);
+
+	if (!ops || !ops->get_max_state || !ops->get_cur_state ||
+	    !ops->set_cur_state)
+		return ERR_PTR(-EINVAL);
+
+	cdev = kzalloc(sizeof(*cdev), GFP_KERNEL);
+	if (!cdev)
+		return ERR_PTR(-ENOMEM);
+
+	idr_init(&cdev->idr);
+	result = get_idr(&thermal_cdev_idr, &cdev->id);
+	if (result)
+		goto exit_free;
+
+	strlcpy(cdev->type, type ? : "", sizeof(cdev->type));
+	mutex_init(&cdev->lock);
+	cdev->ops = ops;
+	cdev->updated = true;
+	cdev->device.class = &thermal_class;
+	cdev->devdata = devdata;
+
+	dev_set_name(&cdev->device, "cdev%d", cdev->id);
+	result = device_register(&cdev->device);
+	if (result)
+		goto exit_idr;
+
+	result = device_create_file(&cdev->device, &dev_attr_type);
+	if (result)
+		goto exit_unregister;
+
+	result = device_create_file(&cdev->device, &dev_attr_max_state);
+	if (result)
+		goto exit_type;
+
+	result = device_create_file(&cdev->device, &dev_attr_cur_state);
+	if (result) {
+		device_remove_file(&cdev->device, &dev_attr_max_state);
+		goto exit_type;
+	}
+
+	/* Add 'this' new cdev to the global cdev list */
+	mutex_lock(&cdev_list_lock);
+	list_add(&cdev->node, &thermal_cdev_list);
+	mutex_unlock(&cdev_list_lock);
+
+	return cdev;
+
+exit_type:
+	device_remove_file(&cdev->device, &dev_attr_type);
+exit_unregister:
+	device_unregister(&cdev->device);
+exit_idr:
+	release_idr(&thermal_cdev_idr, cdev->id);
+	idr_destroy(&cdev->idr);
+exit_free:
+	kfree(cdev);
+	return ERR_PTR(result);
+}
+EXPORT_SYMBOL_GPL(thermal_cdev_register);
+
+/**
+ * thermal_cdev_unregister - removes the registered thermal cooling device
+ * @cdev:      the thermal cooling device to remove.
+ *
+ * thermal_cdev_unregister() must be called when the device is no
+ * longer needed.
+ */
+void thermal_cdev_unregister(struct thermal_cooling_device *cdev)
+{
+	struct thermal_cooling_device *pos, *next;
+	bool found = false;
+
+	if (!cdev)
+		return;
+
+	mutex_lock(&cdev_list_lock);
+	list_for_each_entry_safe(pos, next, &thermal_cdev_list, node) {
+		if (pos == cdev) {
+			list_del(&cdev->node);
+			found = true;
+			break;
+		}
+	}
+	mutex_unlock(&cdev_list_lock);
+	if (!found)
+		return;
+
+	device_remove_file(&cdev->device, &dev_attr_type);
+	device_remove_file(&cdev->device, &dev_attr_max_state);
+	device_remove_file(&cdev->device, &dev_attr_cur_state);
+
+	release_idr(&thermal_cdev_idr, cdev->id);
+	idr_destroy(&cdev->idr);
+	device_unregister(&cdev->device);
+	kfree(cdev);
+	return;
+}
+EXPORT_SYMBOL_GPL(thermal_cdev_unregister);
diff --git a/include/linux/thermal.h b/include/linux/thermal.h
index bb6b183..46d7dc3 100644
--- a/include/linux/thermal.h
+++ b/include/linux/thermal.h
@@ -158,6 +158,7 @@ struct thermal_cooling_device {
 	void *devdata;
 	const struct thermal_cooling_device_ops *ops;
 	bool updated; /* true if the cooling device does not need update */
+	struct idr idr;
 	struct mutex lock; /* protect thermal_instances list */
 	struct list_head thermal_instances;
 	struct list_head node;
@@ -334,6 +335,9 @@ static inline int thermal_generate_netlink_event(struct thermal_zone_device *tz,
 struct thermal_sensor *thermal_sensor_register(const char *, int,
 				struct thermal_sensor_ops *, void *);
 void thermal_sensor_unregister(struct thermal_sensor *);
+struct thermal_cooling_device *thermal_cdev_register(char *, void *,
+				const struct thermal_cooling_device_ops *);
+void thermal_cdev_unregister(struct thermal_cooling_device *);
 #else
 static inline struct thermal_sensor *thermal_sensor_register(const char *name,
 		int count, struct thermal_sensor_ops *ops, void *devdata)
@@ -341,5 +345,13 @@ static inline struct thermal_sensor *thermal_sensor_register(const char *name,
 	return ERR_PTR(-ENODEV);
 }
 static inline void thermal_sensor_unregister(struct thermal_sensor *ts) {}
+static inline struct thermal_cooling_device *thermal_cdev_register(
+				char *type, void *devdata,
+				const struct thermal_cooling_device_ops *ops)
+{
+	return ERR_PTR(-ENODEV);
+}
+static
+inline void thermal_cdev_unregister(struct thermal_cooling_device *cdev) {}
 #endif
 #endif /* __THERMAL_H__ */
-- 
1.7.9.5


^ permalink raw reply related	[flat|nested] 3+ messages in thread

* [PATCHv5 RESEND 08/10] Thermal: Add Documentation to new APIs
  2014-01-17 13:27 [PATCHv5 RESEND 03/10] Thermal: Add cooling device APIs Durgadoss R
@ 2014-01-17 13:27 ` Durgadoss R
  2014-01-17 13:27 ` [PATCHv5 RESEND 09/10] Thermal: Add ABI Documentation for sysfs interfaces Durgadoss R
  1 sibling, 0 replies; 3+ messages in thread
From: Durgadoss R @ 2014-01-17 13:27 UTC (permalink / raw)
  To: rui.zhang, eduardo.valentin, linux-pm
  Cc: linux-kernel, hongbo.zhang, wni, Durgadoss R

This patch adds Documentation for the new APIs
introduced in this patch set. The documentation
also has a model sysfs structure for reference.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
---
 Documentation/thermal/sysfs-api2.txt |  240 ++++++++++++++++++++++++++++++++++
 1 file changed, 240 insertions(+)
 create mode 100644 Documentation/thermal/sysfs-api2.txt

diff --git a/Documentation/thermal/sysfs-api2.txt b/Documentation/thermal/sysfs-api2.txt
new file mode 100644
index 0000000..1045dfc
--- /dev/null
+++ b/Documentation/thermal/sysfs-api2.txt
@@ -0,0 +1,240 @@
+Thermal Framework
+-----------------
+
+Written by Durgadoss R <durgadoss.r@intel.com>
+Copyright (c) 2014 Intel Corporation
+
+Created on: 15 January 2014
+
+0. Introduction
+---------------
+The Linux thermal framework provides a set of interfaces for thermal
+sensors and thermal cooling devices (fan, processor...) to register
+with the thermal management solution and to be a part of it.
+
+This document focuses on how to enable new thermal sensors and cooling
+devices to participate in thermal management. This solution is intended
+to be 'light-weight' and platform/architecture independent. Any thermal
+sensor/cooling device should be able to use the infrastructure easily.
+
+The goal of thermal framework is to expose the thermal sensor/zone and
+cooling device attributes in a consistent way. This will help the
+thermal governors to make use of the information to manage platform
+thermals efficiently.
+
+The thermal sensor source file can be generic (can be any sensor driver,
+in any subsystem). This driver will use the sensor APIs and register with
+thermal framework to participate in platform Thermal management. This
+does not (and should not) know about which zone it belongs to, or any
+other information about platform thermals. A sensor driver is a standalone
+piece of code, which can optionally register with thermal framework.
+
+However, for any platform, there should be a platformX_thermal.c file,
+which will know about the platform thermal characteristics (e.g how many
+sensors, zones, cooling devices, etc.. And how they are related to each other
+i.e the mapping information). Only in this file, the zone level APIs should
+be used, in which case the file will have all information required to attach
+various sensors to a particular zone.
+
+This way, we can have one platform level thermal file, which can support
+multiple platforms (may be)using the same set of sensors (but)binded in
+a different way. This file can get the platform thermal information
+through Firmware, ACPI tables, device tree etc.
+
+Unfortunately, today we don't have many drivers that can be clearly
+differentiated as 'sensor_file.c' and 'platform_thermal_file.c'.
+But very soon we will need/have. We see a lot of chip drivers,
+starting to use thermal framework; we should keep it really
+light-weight for them to do so but at the same time provide all
+the necessary features to participate in platform thermal management.
+
+An Example: drivers/hwmon/emc1403.c - a generic thermal chip driver
+In one platform this sensor can belong to 'ZoneA' and in another the
+same can belong to 'ZoneB'. But, emc1403.c does not really care about
+where does it belong. It just reports temperature.
+
+1. Terminology
+--------------
+This section describes the terminology used in the rest of this
+document as well as the thermal framework code.
+
+thermal_sensor: Hardware that can report temperature of a particular
+		spot in the platform, where it is placed. The temperature
+		reported by the sensor is the 'real' temperature reported
+		by the hardware.
+thermal_zone:	A virtual area on the device, that gets heated up. It may
+		have one or more thermal sensors attached to it.
+cooling_device:	Any component that can help in reducing the temperature of
+		a 'hot spot' either by reducing its performance (passive
+		cooling) or by other means(Active cooling E.g. Fan)
+
+trip_points:	Various temperature levels for each sensor. As of now, we
+		have four levels namely active, passive, hot and critical.
+		Hot and critical trip point support only one value whereas
+		active and passive can have any number of values. These
+		temperature values can come from platform data, and are
+		exposed through sysfs in a consistent manner. Stand-alone
+		thermal sensor drivers are not expected to know these values.
+		These values are RO.
+thresholds:	These are programmable temperature limits, on reaching which
+		the thermal sensor generates an interrupt. The framework is
+		notified about this interrupt to take appropriate action.
+		There can be as many number of thresholds as that of the
+		hardware supports. These values are RW.
+
+thermal_map:	This provides the mapping (aka binding) information between
+		various sensors and cooling devices in a particular zone.
+		Typically, this also comes from platform data; Stand-alone
+		sensor drivers or cooling device drivers are not expected
+		to know these mapping information.
+
+2. Thermal framework APIs
+-------------------------
+2.1: For Thermal Sensors
+2.1.1 thermal_sensor_register:
+	This function creates a new sensor directory under /sys/class/thermal/
+	as sensor[0-*]. This API is expected to be called by thermal sensor
+	drivers. These drivers may or may not be in thermal subsystem. This
+	function returns a thermal_sensor structure on success and appropriate
+	error on failure.
+
+	name: Name of the sensor
+	count: Number of programmable thresholds associated with this sensor
+	devdata: Device private data
+	ops: Thermal sensor callbacks
+		.get_temp: obtain the current temperature of the sensor
+		.get_trend: obtain the trend of the sensor
+		.get_threshold: get a particular threshold temperature
+		.set_threshold: set a particular threshold temperature
+		.get_hyst: get hysteresis value associated with a threshold
+		.set_hyst: set hysteresis value associated with a threshold
+
+2.1.2 thermal_sensor_unregister:
+	This function deletes the sensor directory under /sys/class/thermal/
+	for the given sensor. Thermal sensor drivers may call this API
+	during the driver's 'exit' routine.
+
+	ts: Thermal sensor that has to be unregistered
+
+2.2: For Cooling Devices
+2.2.1 thermal_cdev_register:
+	This function adds a new thermal cooling device (fan/processor/...)
+	to /sys/class/thermal/ folder as cdev[0-*]. This function
+	is expected to be called by cooling device drivers that may be
+	present in other subsystems also.
+
+	name: the cooling device name
+	devdata: device private data
+	ops: thermal cooling devices callbacks
+	.get_max_state: get the Maximum throttle state of the cooling device
+	.get_cur_state: get the Current throttle state of the cooling device
+	.set_cur_state: set the Current throttle state of the cooling device
+
+2.2.2 thermal_cdev_unregister:
+	This function deletes the given cdev entry form /sys/class/thermal;
+	and also cleans all the symlinks referred from various zones.
+
+	cdev: Cooling device to be unregistered
+
+2.3: For Thermal Zones
+2.3.1 thermal_create_thermal_zone:
+	This function adds a new 'zone' under /sys/class/thermal/
+	directory as zone[0-*]. This zone has at least one thermal
+	sensor and at most MAX_SENSORS_PER_ZONE number of sensors
+	attached to it. Similarly, this zone has at least one cdev
+	and at most MAX_CDEVS_PER_ZONE number of cdevs attached to it.
+	As of now, MAX_*_PER_ZONE values are hard-coded to 5. We can
+	make them configurable, through Kconfig option(during 'menuconfig').
+
+	name: Name of the thermal zone
+	devdata: Device private data
+
+2.3.2 thermal_add_sensor_to_zone
+	This function adds a 'sensorX' entry under /sys/class/thermal/
+	zoneY/ directory. This 'sensorX' is a symlink to the actual
+	sensor entry under /sys/class/thermal/. Correspondingly, the
+	method remove_sensor_from_zone deletes the symlink.
+
+	tz: thermal zone structure
+	ts: thermal sensor structure
+
+2.3.3 thermal_add_cdev_to_zone
+	This function adds a 'cdevX' entry under /sys/class/thermal/
+	zoneY/ directory. This 'cdevX' is a symlink to the actual
+	cdev entry under /sys/class/thermal/. Correspondingly, the
+	method remove_cdev_from_zone deletes the symlink.
+
+	tz: thermal zone structure
+	cdev: thermal cooling device structure
+
+2.4 For Thermal Trip
+2.4.1 thermal_add_sensor_trip_info
+	This function adds trip point information for the given sensor,
+	(under a given zone) under /sys/class/thermal/zoneX/.
+	This API creates sysfs attributes namely:
+	sensorX_trip_activeY, sensorX_trip_passiveY, sensorX_trip_hot,
+	sensorX_trip_critical. Each of these hold one trip point temperature
+	(in mC) values, as provided from platform data. As of now, we
+	support many Active and Passive trip points but only one hot
+	one critical trip point.
+
+	tz: thermal zone structure
+	ts: thermal sensor to which the trip points are attached
+	trip: trip point structure. Usually obtained from platform data
+
+2.5 For Thermal Map
+2.5.1 thermal_add_map_entry
+	This function adds a 'map[0-*]' sysfs attribute under
+	/sys/class/thermal/zoneX/mapY_*. Each map attribute helps
+	to describe the binding relationship between a sensor and
+	a cdev in the given zone. The map structure is typically
+	obtained as platform data. For example, through ACPI tables,
+	SFI tables, Device tree etc. The trip mask is a hex value;
+	if 'n' th bit (from LSB) is set, then for trip point 'n' this
+	cdev is throttled with the given weight[n].
+
+	tz: thermal zone to which a 'map' is being added
+	map: thermal_map structure
+
+3. Sysfs attributes structure
+-----------------------------
+Thermal sysfs attributes will be represented under /sys/class/thermal.
+
+3.1: For Thermal Sensors
+	/sys/class/thermal/sensor[0-*]:
+		|---type:		Name of the thermal sensor
+		|---temp_input:		Current temperature in mC
+		|---threshold[0-*]:	Threshold temperature in mC
+		|---threshold[0-*]_hyst:Optional hysteresis value in mC
+
+3.2: For Thermal Cooling Devices
+	/sys/class/thermal/cdev[0-*]:
+		|---type:		Type of the cooling device
+		|---max_state:		Maximum throttle state of the cdev
+		|---cur_state:		Current throttle state of the cdev
+
+3.3: For Thermal Zones
+	/sys/class/thermal/zone[0-*]:
+		|---zone_name:			Name of the thermal zone
+		|---sensorX:			Symlink to ../sensorX
+		|---cdevY:			Symlink to ../cdevY
+		|---sensorX_trip_activeM:	Active trip point for sensorX
+		|---sensorX_trip_passiveN:	Passive trip point for sensorX
+		|---sensorX_trip_hot:		Hot trip point for sensorX
+		|---sensorX_trip_critical:	Critical trip point for sensorX
+		|---mapX_sensor_name:		Sensor Name
+		|---mapX_cdev_name:		Cooling device Name
+		|---mapX_trip_type:		Trip point type
+		|---mapX_trip_mask:		Trip point mask
+		|---mapX_weightY:		Weights (used by governors)
+
+3.5: For Thermal Map
+	Each attribute represents the mapping/binding information between
+	a sensor and a cdev, together with a trip type.
+	/sys/class/thermal/zoneX/:
+		|---mapY_trip_type:		active/passive
+		|---mapY_sensor_name:		cpu
+		|---mapY_cdev_name:		proc
+		|---mapY_trip_mask:		0x03
+		|---mapY_weight0:		50
+		|---mapY_weight1:		30
-- 
1.7.9.5

^ permalink raw reply related	[flat|nested] 3+ messages in thread

* [PATCHv5 RESEND 09/10] Thermal: Add ABI Documentation for sysfs interfaces
  2014-01-17 13:27 [PATCHv5 RESEND 03/10] Thermal: Add cooling device APIs Durgadoss R
  2014-01-17 13:27 ` [PATCHv5 RESEND 08/10] Thermal: Add Documentation to new APIs Durgadoss R
@ 2014-01-17 13:27 ` Durgadoss R
  1 sibling, 0 replies; 3+ messages in thread
From: Durgadoss R @ 2014-01-17 13:27 UTC (permalink / raw)
  To: rui.zhang, eduardo.valentin, linux-pm
  Cc: linux-kernel, hongbo.zhang, wni, Durgadoss R

This patch adds Documentation for ABI's introduced
for thermal subsystem (under /sys/class/thermal/).

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
---
 Documentation/ABI/testing/sysfs-class-thermal |  161 +++++++++++++++++++++++++
 1 file changed, 161 insertions(+)
 create mode 100644 Documentation/ABI/testing/sysfs-class-thermal

diff --git a/Documentation/ABI/testing/sysfs-class-thermal b/Documentation/ABI/testing/sysfs-class-thermal
new file mode 100644
index 0000000..144efc1
--- /dev/null
+++ b/Documentation/ABI/testing/sysfs-class-thermal
@@ -0,0 +1,161 @@
+What:		/sys/class/thermal/sensorX/temp
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Exposes 'temperature' of a thermal sensor in mC
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/sensorX/name
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Name of the thermal sensor
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/sensorX/thresholdY
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Programmable threshold (in terms of mC). On reaching
+		this, the thermal governors may take action to control
+		temperature.
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/cdevX/type
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Type of the cooling device
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/cdevX/cur_state
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Current throttle state the cooling device is in
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/cdevX/max_state
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Maximum number of throttle states the cooling device supports
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/zone_name
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Name of the thermal zone.
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/sensorY
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Symlink to a sensor associated with this zone.
+Users:		User space thermal governors or applications
+
+What:		/sys/class/thermal/zoneX/cooling_deviceY
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Symlink to a cooling device associated with this zone.
+Users:		User space thermal governors or applications
+
+What:		/sys/class/thermal/zoneX/sensorY_trip_activeM
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Active Trip point temperature in mC for sensorY in
+		thermal zoneX.
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/sensorY_trip_passiveN
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Passive Trip point temperature in mC for sensorY in
+		thermal zoneX.
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/sensorY_trip_hot
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Hot trip point for 'sensorY' in 'zoneX' (in mC).
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/sensorY_trip_critical
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Critical trip point for 'sensorY' in 'zoneX' (in mC).
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/mapY_trip_type
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Mapping information between a sensor and a cooling device
+		in 'zoneX'. This interface provides the trip_type for a
+		particular map(Y).
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/mapY_sensor_name
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Mapping information between a sensor and a cooling device
+		in 'zoneX'. This interface provides the name of the sensor
+		used in this map(Y).
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/mapY_cdev_name
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Mapping information between a sensor and a cooling device
+		in 'zoneX'. This interface provides the name of the cooling
+		device used in this map(Y).
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/mapY_trip_mask
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Mapping information between a sensor and a cooling device
+		in 'zoneX'. This interface provides the trip point mask,
+		which defines whether or not to throttle a particular
+		cooling device. See Documentation/thermal/sysfs-api2.txt
+		for more information on this interface.
+Users:		Kernel/User space thermal governors
+
+What:		/sys/class/thermal/zoneX/mapY_weightN
+Date:		January 2014
+KernelVersion:	3.13
+Contact:	Linux PM Mailing list <linux-pm@vger.kernel.org>
+Description:
+		Mapping information between a sensor and a cooling device
+		in 'zoneX'. This interface provides the weights that can
+		be used to throttle a cooling device, on thermal violations.
+		See Documentation/thermal/sysfs-api2.txt for more details on
+		this interface.
+Users:		Kernel/User space thermal governors
-- 
1.7.9.5


^ permalink raw reply related	[flat|nested] 3+ messages in thread

end of thread, other threads:[~2014-01-17 13:27 UTC | newest]

Thread overview: 3+ messages (download: mbox.gz follow: Atom feed
-- links below jump to the message on this page --
2014-01-17 13:27 [PATCHv5 RESEND 03/10] Thermal: Add cooling device APIs Durgadoss R
2014-01-17 13:27 ` [PATCHv5 RESEND 08/10] Thermal: Add Documentation to new APIs Durgadoss R
2014-01-17 13:27 ` [PATCHv5 RESEND 09/10] Thermal: Add ABI Documentation for sysfs interfaces Durgadoss R

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