[PATCH] thermal: Bind cooling devices with the correct arguments

[Punit Agrawal <punit.agrawal@arm.com>]

When binding cooling devices to thermal zones created from the device
tree the minimum and maximum cooling states are in the wrong order
leading to failure to bind.

Fix the order of cooling states in the call to
thermal_zone_bind_cooling_device to fix this.

Cc:Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
---
Hi Eduardo,

I am hoping this can be picked up for 3.16 as a bug fix.

Thanks,
Punit

 drivers/thermal/of-thermal.c |    4 ++--
 1 file changed, 2 insertions(+), 2 deletions(-)

diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
index 04b1be7..97d312f 100644
--- a/drivers/thermal/of-thermal.c
+++ b/drivers/thermal/of-thermal.c
@@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
 
 			ret = thermal_zone_bind_cooling_device(thermal,
 						tbp->trip_id, cdev,
-						tbp->min,
-						tbp->max);
+						tbp->max,
+						tbp->min);
 			if (ret)
 				return ret;
 		}
-- 
1.7.10.4